Reticle Particle Source Positioning via Path Data Analysis
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor manufacturing, reticles easily adsorb particles during lithography processes, leading to decreased product yield and increased costs due to the inability to track and position sources of these particles effectively, resulting in unnecessary reworking of wafers.
Innovation Solution
A method and apparatus that determine the positions and source locations of particles on reticles by analyzing path data and generating a particle position analysis report, allowing for targeted cleaning and reducing resource waste.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If reticle inspection is performed after each exposure using IRIS, then particle detection capability is improved, but manufacturing cost and time consumption increase significantly
Solution Approach 1:
The patent applies preliminary action by performing particle source positioning through path data analysis before wafer rework decisions are made. The system tracks reticle movement paths and analyzes particle appearance locations to identify potential contamination sources in advance, enabling targeted inspection and cleaning rather than blanket rework of all wafers.
Solution Approach 2:
The patent introduces path data as an intermediary element that mediates between particle detection and source identification. By analyzing the reticle's movement path data in conjunction with particle detection results, the system can infer particle source locations without requiring extensive additional inspection, thus reducing overall manufacturing cost and time.
2Reliability
If all wafers are reworked when particles are found on reticle, then product quality is improved, but resource waste and labor cost increase
Solution Approach 1:
The patent applies local quality by using path data analysis to identify specific particle source locations on the reticle. Instead of treating the entire reticle as contaminated, the system determines localized contamination sources and enables targeted cleaning of specific areas, allowing non-affected wafers to continue production without rework.
Solution Approach 2:
The patent enables recovery of manufacturing resources by identifying and isolating particle sources. Wafers processed before particle contamination can be recovered and continued in production, while only minimal cleaning operations are performed on the reticle rather than complete rework cycles.
3Device complexity
If particle source positioning is not implemented, then manufacturing process simplicity is maintained, but particle detection effectiveness decreases
Solution Approach 1:
The patent applies universality by using the existing reticle path data, which is already collected for other manufacturing purposes, and giving it a additional function of particle source positioning. This multi-functional use of path data avoids adding complex dedicated tracking hardware while still achieving particle source identification.
Solution Approach 2:
The patent implements feedback by using particle detection results combined with path data to identify particle sources, then using this information to guide subsequent cleaning operations. The system continuously refines particle source positioning accuracy by analyzing the relationship between reticle positions and particle appearance locations.
Data Source
AI summary
A positioning method for particles on a reticle includes: data of positions passed by a target reticle within a preset period of time is determined according to path data of the target reticle that includes particle information of the target reticle at each scan moment; position information of the target reticle when particles are present on a surface of the target reticle is determined according to the data of positions, to obtain target position data of the target reticle; reticle position data of the target reticle within adjacent scan moments is determined according to the target position data, and a particle source position of the particles on the surface of the target reticle is determined from the reticle position data according to position priorities; and a particle position analysis report of the target reticle within the preset period of time is generated according to the particle source position.