Reticle Transfer System for Semiconductor Fab Traffic

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Solution Overview

Problem

The semiconductor industry faces challenges in efficiently managing the transportation of reticles and wafers within integrated circuit fabrication facilities due to increasing complexity and the need for multiple lithography steps, leading to traffic jams and delays in the production cycle.

Innovation Solution

A reticle transfer system is introduced, dividing the fab layout into a global and local system with an adjustable internal buffer, allowing for independent transportation and reducing the need for multiple carriers and rails, thereby alleviating traffic jams and improving production efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single centralized transportation system is used for reticles and wafers in the fab, then the system structure is simple, but traffic jams and delays occur due to increasing production complexity

Engineering Contradiction:
Improvetransportation system structureVSAvoidproduction cycle efficiency
Core Design Contradiction:
Device complexityVSProductivity

Solution Approach 1:

The transportation system is divided into separate global and local systems. The global system handles inter-bay reticle and wafer transportation, while the local system manages intra-bay reticle transportation between stockers and lithography apparatus. This segmentation prevents traffic congestion by distributing transportation loads across independent systems rather than using a single centralized system.

Inventive Principle:
Principle #1Segmentation

2Adaptability or versatility

If multiple carriers and rails are used for reticle transportation, then transportation flexibility is improved, but system complexity and cost increase

Engineering Contradiction:
Improvetransportation flexibilityVSAvoidnumber of carriers and rails
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The global carrier is designed to perform multiple functions: it transports both reticles and wafers between bays in the global system, and can also serve as a reticle carrier within the local system when needed. This multi-functionality reduces the need for separate specialized carriers for different transportation tasks, thereby reducing overall system complexity while maintaining flexibility.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Loss of time

If reticles are transported directly between stockers and lithography apparatus without buffer, then response time is reduced, but traffic congestion increases during peak demand

Engineering Contradiction:
Improvereticle response timeVSAvoidtransportation efficiency
Core Design Contradiction:
Loss of timeVSProductivity

Solution Approach 1:

The global carrier acts as an intermediary between the global and local transportation systems. It receives reticles from the global system and delivers them to the local system, which then distributes them to the appropriate lithography apparatus. This intermediary approach allows the system to handle peak demand efficiently by using the buffer capacity of the global carrier, while still maintaining relatively fast response times through the streamlined local distribution network.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS10991607B2Reticle transfer system and method
Publication Date: 2021.04.27 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US10991607B2 patent drawing
  • US10991607B2 patent drawing
  • US10991607B2 patent drawing

AI summary

A method comprises transporting semiconductor devices between a global system and a local system, wherein an input terminal of the local system is connected to the global system, and wherein the global system comprises a plurality of stockers and a global transportation system connected to the stockers and the local system comprises a first service area, an internal buffer, a second service area and a plurality of lithography apparatuses and transporting a semiconductor device from the first service area to a lithography apparatus in the second service area.