Retractable I/O Interface for Thin Electronic Devices
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Solution Overview
Problem
Conventional electronic devices with I/O interfaces exposed on the side suffer from dust and dirt contamination, irregular edge structure, and limited development of super-thin designs due to the thickness of these interfaces.
Innovation Solution
An electronic device design featuring a first case with a accommodating space for an interface part, where the interface part is snap-fitted inside when not in use, concealing the I/O interfaces and maintaining a regular exterior, and positioned on a thicker area to avoid affecting the thin edge, using a flexible connecting band for secure connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If I/O interfaces are disposed on the side of the computer and exposed outside, then information transmission can be implemented by connecting external devices, but dust and dirt easily enter the I/O interfaces affecting connection performance
Solution Approach 1:
The I/O interface is segmented into two states: exposed for connection and retracted for protection. The interface part can be separated from the accommodating space to expose connecting ports for external device connection, or accommodated inside the case to protect ports from dust and dirt contamination.
Solution Approach 2:
The I/O interface transitions from a static exposed structure to a dynamic retractable structure. The interface part can move between an exposed state (for connection) and a retracted state (for protection), allowing the system to adapt its configuration based on operational needs.
2Ease of operation
If I/O interfaces are disposed on the side of the computer, then information transmission is enabled, but the structure of the side becomes irregular
Solution Approach 1:
The interface part is nested within the accommodating space of the first case. When not in use, the interface part is completely accommodated inside, forming a complete surface with the first surface of the case, thereby maintaining a regular external structure while preserving connection functionality when needed.
3Length of moving object
If the edge of the computer is made thinner for better appearance and portability, then appearance and portability improve, but disposing thick I/O interfaces on the edge makes the edge thick, limiting super-thin edge development
Solution Approach 1:
The I/O interface is moved from the thin edge dimension to the thick middle part dimension. The interface part is disposed on the thick middle part where sufficient thickness exists to accommodate the interface, allowing the edge to remain thin while preserving full I/O functionality.
Data Source
AI summary
An electronic device is provided, comprising: a first case having a first accommodating space, where a first surface of the first case has a first opening for the first accommodating space; and an interface part having a bottom surface with a same shape as the first opening, where the bottom surface is a cross section with a greatest area of the interface part. M I/O interfaces are disposed inside the interface part, and connecting ports of the M I/O interfaces are exposed on a first surface of the interface part which is not the bottom surface, M is an integer greater than or equal to 1; and the M I/O interfaces are connected to a circuit board located inside the first case.