Retractable Pad Gripper for Semiconductor Handling

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Solution Overview

Problem

Existing manipulators for semiconductor structures, particularly silicon wafers used in photovoltaic cell manufacturing, fail to prevent surface contamination and aerodynamic disturbances during handling and positioning, complicating the process.

Innovation Solution

A gripping device with a suction system using compressed gas and retractable contact studs, featuring a rotary actuation mechanism and gas exhaust ports to minimize air disturbance, and a limited number of retractable contact pads to prevent contamination, is designed for handling monolayer or multilayer structures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If a gripper is used to handle silicon wafers before and after processes, then the handling operation is simplified, but the risk of surface contamination increases

Engineering Contradiction:

Improvehandling operationVSAvoidsurface contamination

Core Design Contradiction:

Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The gripper is divided into two separate units: a first gripper for handling wafers before the process and a second gripper for handling wafers after the process. This segmentation prevents cross-contamination while maintaining ease of operation, as each gripper is dedicated to a specific handling stage.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The second gripper is designed with retractable contact pads that can be completely retracted into the hollow body. This extraction of the contact pads from the external environment eliminates the contamination risk associated with permanent external contacts while preserving the gripping function.

Inventive Principle:

Principle #2Taking out (Extraction)

2Ease of operation

If conventional grippers are used for positioning silicon wafers, then the positioning operation is performed, but aerodynamic disturbances are generated

Engineering Contradiction:

Improvepositioning operationVSAvoidaerodynamic disturbance

Core Design Contradiction:

Ease of operationVSObject-generated harmful factors

Solution Approach 1:

The second gripper uses a pneumatic suction system with compressed gas supply and exhaust orifices to hold and position the wafer. This pneumatic approach generates minimal aerodynamic disturbance compared to mechanical contact-based positioning, while maintaining effective positioning capability.

Inventive Principle:

Principle #29Pneumatics and hydraulics

Solution Approach 2:

The hollow body of the second gripper creates a contained environment that isolates the wafer from external air currents. The retractable contact pads and controlled gas flow within this enclosed space minimize turbulence and aerodynamic disturbances during positioning operations.

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

3Reliability

If multiple contact pads are permanently extended, then the gripping reliability is improved, but the contamination risk increases

Engineering Contradiction:

Improvegripping reliabilityVSAvoidcontamination risk

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The contact pads of the second gripper are designed to be dynamically retractable rather than statically extended. This dynamic capability allows the contact pads to be extended only when needed for gripping and retracted when not in use, maintaining gripping reliability while minimizing contamination risk during storage and transport.

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The device effectively grips and positions semiconductor structures while minimizing contamination risks and aerodynamic disturbances, ensuring precise handling and deposition without generating air turbulence.

Implementation Method 1

a suction system using compressed gas, in particular compressed air, comprising at least one compressed gas supply orifice and at least one gas exhaust orifice... said bottom wall comprising a plurality of suction orifices facing - screw of the suction system capable of allowing the gripping of the structure by suction

Methodology Applied

Scientific EffectSuction: Suction

Data Source

PatentEP3330049B1Device for gripping a single-layer or multi-layer structure comprising a suction system and retractable pads

Publication Date: 2019.09.18 COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

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AI summary

The main object of the invention is a gripping device (1) for a structure (2), characterized in that it comprises: a compressed gas suction system (3), including a compressed gas supply orifice (4) and a gas exhaust orifice (5); a hollow body (6) comprising an internal cavity, delimited by an internal lateral surface and a bottom wall of the hollow body (6), which has a plurality of suction orifices; a plurality of retractable contact pads, suitable for coming into contact with the structure (2) and positioned through pad orifices in the bottom wall; and rotating means for actuating the contact pads suitable for selectively allowing a portion of the pads to protrude to come into contact with the structure (2) while the other pads are retracted relative to said bottom wall without contact with the structure (2).