Retractable Probe Test Socket for Fine Pitch Inspection
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Solution Overview
Problem
Conventional test sockets struggle with inspecting semiconductor chips with fine pitches due to their complex structure and high production costs, and they face challenges in providing the necessary elasticity and contact precision for fine-patterned terminals.
Innovation Solution
A test socket design featuring retractable probes supported by a probe supporter, a printed circuit board (PCB) with electronic parts, and a lower supporter, which includes conductive portions for contact with the PCB pads, allowing for flexible and precise signal transmission and reducing production complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the contact probe has a short length to make a short signal path, then signal loss is minimized, but it is difficult to provide enough elasticity to absorb pressure applied for the test
Solution Approach 1:
The test socket is divided into multiple functional layers: a probe supporter layer that holds the contact probes, and a PCB layer with electronic parts. This segmentation allows the probe supporter to provide mechanical support and elasticity while the PCB provides the electrical connection path, resolving the contradiction between short signal path and sufficient elasticity.
2Device complexity
If the contact probe, electronic parts and conductive path are formed in a single substrate, then the structure is integrated, but it is difficult to be used for inspecting subjects having a fine pitch and production cost increases
Solution Approach 1:
The invention separates the probe supporter (holding contact probes) from the PCB (with electronic parts and conductive paths). This segmentation allows independent optimization: the probe supporter can be designed with appropriate elasticity and probe arrangement for fine pitch inspection, while the PCB can be designed with precise electronic parts and conductive paths without the constraints of integrating all functions in a single substrate.
3Device complexity
If the contact probe, electronic parts and conductive path are formed in a single substrate, then the structure is integrated, but design becomes very complicated and production cost increases
Solution Approach 1:
By dividing the test socket into a probe supporter component and a PCB component, each can be manufactured separately using standard processes. The probe supporter can be manufactured with simple probe mounting, while the PCB can be manufactured using standard PCB fabrication processes with electronic parts mounted separately. This reduces design complexity and production cost compared to integrating all functions in a single substrate.
Data Source
AI summary
Disclosed is a test socket for inspecting an electronic device that is particular about properties.The test socket for inspecting electric properties of a subject includes a plurality of probes configured to be retractable in an inspection direction; a probe supporter configured to support the plurality of probes so that first ends of the plurality of probes protrudes to contact with an object contact point of a subject; and a printed circuit board (PCB) configured to be placed beneath the probe supporter, be mounted with electronic parts, be formed with holes through which second ends of the plurality of probes pass, include at least one first pad with which at least one second end of the plurality of probes comes into contact and at least one second pad formed on an opposite side to the first pad, and be formed with electric paths extended from the first pad and the second pad and connected to the mounted electronic parts.