Reusable Die Catch and Release Materials for Laser Die Transfer
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Solution Overview
Problem
The transfer and placement of semiconductor die, particularly in laser-assisted applications, face complexities related to materials used, including costs and efficiency issues.
Innovation Solution
A system and method utilizing reusable die catch and die release materials, facilitated by a laser-based transfer process, where die are transferred from a die source to a receive substrate using a reusable die catch material and a partially reusable die release material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If consumable materials are used in die transfer processes, then die transfer can be achieved, but material costs and process complexity increase
Solution Approach 1:
The patent implements reusable die catch materials and reusable die release materials that can be recovered and reused across multiple transfer cycles. The die catch material is removed from the receive substrate after die transfer and reused on subsequent receive substrates, while the die release material is recovered from the carrier and reused for subsequent die sources, eliminating the need for continuous consumption of these materials
Solution Approach 2:
The reusable materials are designed to maintain their functional properties through multiple use cycles without requiring complex regeneration processes. The die catch material and die release material inherently retain their adhesive and release characteristics, allowing them to serve themselves across multiple transfers without additional processing
2Ease of manufacture
If consumable materials are used in die transfer processes, then die transfer can be achieved, but process complexity increases
Solution Approach 1:
The system establishes a recovery and reuse mechanism where the die catch material is systematically removed from used receive substrates and applied to new receive substrates, and the die release material is recovered from carriers and reused. This standardized recovery process simplifies overall system complexity by eliminating the need for continuous material preparation and disposal steps
3Loss of substance
If reusable die catch material is used, then material costs are reduced, but material reuse capability must be implemented
Solution Approach 1:
The die catch material is designed to be easily removed from the receive substrate after die transfer and reused on subsequent receive substrates. The material maintains its adhesive properties through multiple use cycles, requiring only simple transfer between substrates without complex regeneration or reconditioning processes
Solution Approach 2:
The reusable die catch material is designed with universal applicability across multiple receive substrates and transfer cycles. The material's adhesive properties and physical characteristics remain consistent throughout reuse, allowing it to perform the same function across different substrates without requiring substrate-specific customization
4Loss of substance
If reusable die release material is used, then material costs are reduced, but material reuse capability must be implemented
Solution Approach 1:
The die release material is recovered from the carrier after die transfer and reused for subsequent die sources. The material is systematically removed from used carriers and applied to new carriers, maintaining its release properties across multiple cycles without requiring complex regeneration processes
Solution Approach 2:
The reusable die release material is designed with universal applicability across multiple carriers and transfer cycles. The material's release characteristics remain consistent throughout reuse, allowing it to perform the same function on different carriers without requiring carrier-specific customization or reconditioning
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces material costs and process complexity by allowing the reuse of die catch and die release materials, enhancing the efficiency and cost-effectiveness of die transfer processes.
Implementation Method 1
a laser source for providing energy to interact with a die release material to transfer the plurality of die from the die source to the receive substrate
Data Source
AI summary
A system for transfer of a plurality of die from a die source to a receive substrate is provided. The system includes a die source including a plurality of die, the plurality of die being coupled to a carrier. The system also includes a receive substrate to receive the plurality of die from the die source. The receive substrate includes a die catch material for receiving the plurality of die from the die source, the die catch material being reusable. The system also includes a laser source for providing energy to interact with a die release material to transfer the plurality of die from the die source to the receive substrate.