Reusable Double-Sided Adhesive Layer for Fiber-Reinforced Parts
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Solution Overview
Problem
Existing methods for fixing fiber-reinforced plastic strips in molds, such as electrostatic adhesion and adhesive application, are costly, time-consuming, and can contaminate the surface, while non-conductive fibers are not viable, and existing adhesive methods require significant material and labor for application and removal.
Innovation Solution
An adhesive layer is applied to the mold surface with an adhesive force greater than the adhesive force on the strip segments, allowing multiple uses without contamination, reducing labor and material costs, and ensuring secure adhesion during the molding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrostatic adhesion is used to fix fiber-reinforced plastic strips in molds, then secure adhesion is achieved, but high electrical insulation costs and complex insulation requirements increase production expenses
Solution Approach 1:
The patent replaces the electrostatic field-based adhesion system with a mechanical/chemical adhesive system. Instead of using high-voltage electricity to create adhesion, a double-sided adhesive layer is applied to the mold surface, eliminating the need for complex electrical insulation and high-voltage generators while achieving secure adhesion of the fiber-reinforced plastic strips.
Solution Approach 2:
The patent employs a disposable adhesive layer that is applied to the mold surface and then removed after use. This adhesive layer is inexpensive compared to the complex electrical insulation systems required for electrostatic adhesion, and its disposable nature simplifies the overall system while maintaining effective adhesion during the molding process.
2Reliability
If adhesive means are applied to fix strip segments in molds, then adhesion is achieved, but surface contamination and additional material/labor costs occur
Solution Approach 1:
The patent introduces a double-sided adhesive layer as an intermediary substance between the mold surface and the fiber-reinforced plastic strip segments. This adhesive layer mediates the adhesion process by providing controlled bonding surfaces on both sides, preventing direct contact that would cause contamination while ensuring secure attachment of the segments to the mold.
Solution Approach 2:
The adhesive layer is applied locally only to the specific areas of the mold surface where strip segments need to be fixed, rather than coating the entire mold. This localized application minimizes the risk of adhesive residue contaminating other areas of the molded part while ensuring adequate adhesion zones for the segments.
3Productivity
If adhesive layer is applied to mold surface for multiple uses, then cost and time are reduced, but adhesion force may degrade over repeated use
Solution Approach 1:
The patent implements a system where the adhesive layer is applied to the mold surface, used for fixing strip segments during multiple molding cycles, and then removed and disposed of after a predetermined number of uses or when adhesion force degrades. This approach allows the mold to be prepared efficiently for production while managing the lifecycle of the adhesive layer to maintain reliable adhesion performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive layer method allows for repeated use, reducing overall costs and time, while maintaining secure adhesion and a smooth surface finish, suitable for both new and existing systems, and is applicable to both conductive and non-conductive fibers.
Implementation Method 1
an adhesive layer (3) is applied to the inner wall (2) of the injection mold (2)
Implementation Method 2
after the temperature of the adhesive layer has been increased through the contact with a melted plastic matrix
Data Source
AI summary
In a method for producing fiber-reinforced plastic parts in a mold and an adhesive layer for carrying out the method, the adhesive layer adhesive force on the mold is greater than the adhesive layer adhesive force on the segment, so that, after a first segment is removed, the adhesive layer remains completely in the mold and after the temperature of the adhesive layer is increased through contact with a melted plastic matrix, the remaining adhesive force is sufficient to adhere at least a second segment. The adhesive layer, introduced into the mold relatively expensively, and removed from the mold and disposed of at further expense, is used repeatedly, not just for a single adhesion operation. The expense for procuring the adhesive layer, its introduction into the mold, removal and disposal remains but through its division over numerous production operations, the total expenditure proportion for each operation decreases dramatically.
