Reusable Socket System for Circuit Board Testing
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Solution Overview
Problem
Conventional system-level testing apparatuses require manual customization of system circuit boards and electrical connection sockets, leading to increased testing time and cost due to the inability to reuse sockets across different customer requirements.
Innovation Solution
A system-level testing apparatus and system-level testing system design featuring a holding structure and chip carrying device with welded and fixed electrical connection sockets, allowing for easy change and reuse of system circuit boards and shared sockets across different customers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electrical connection sockets are welded and fixed onto system circuit boards according to different customer requirements, then the system circuit boards can be customized to meet specific customer needs, but the electrical connection sockets cannot be reused across different customers, leading to increased production time and cost
Solution Approach 1:
The system is divided into separate components: system circuit boards and electrical connection sockets are independent entities that can be separately manufactured and configured. This allows sockets to be detached from one circuit board and attached to another, enabling reuse across different customers while maintaining customization capability.
Solution Approach 2:
The electrical connection sockets are designed as universal components that can be used across multiple system circuit boards and different customer applications. By making sockets multi-functional and interchangeable, the system achieves both customization for different customers and reusability of the same socket inventory.
2Adaptability or versatility
If different system circuit boards are produced according to different customer requirements, then customer-specific needs are met, but the overall testing time and cost increase due to inability to share sockets
Solution Approach 1:
Electrical connection sockets are pre-configured and pre-tested on standardized carrier boards before being deployed to customer-specific system circuit boards. This preliminary preparation allows for rapid deployment and testing on actual customer systems, reducing overall testing time while maintaining customization capability.
Solution Approach 2:
The system enables recovery and reuse of electrical connection sockets after testing. Sockets are detached from tested circuit boards and transferred to new or reused carrier boards for subsequent testing operations, thereby reducing the time required to set up new test configurations and eliminating the need to permanently discard sockets after each test cycle.
3Manufacturing precision
If electrical connection sockets are permanently attached to system circuit boards, then each board is optimized for its specific customer requirement, but the cost and time required to detach and dispose of sockets increases
Solution Approach 1:
The connection between electrical connection sockets and system circuit boards is made dynamic rather than static. Sockets can be easily attached and detached using standardized mechanical or electrical connection mechanisms, allowing for rapid reconfiguration between different customer-specific boards without complex detachment procedures or permanent attachment methods.
Data Source
AI summary
A system-level testing apparatus and a system-level testing system are provided. The system-level testing apparatus includes an apparatus body, a chip carrying device, and a control device. A holding structure in the apparatus body is configured to hold a system circuit board. The chip carrying device includes a carrying circuit board, and a plurality of electrical connection sockets and a plurality of connection structures are disposed on the carrying circuit board. The electrical connection structures are electrically connected to the connection structures. When the electrical connection sockets carry a plurality of chips under test, the carrying circuit board is disposed on the system circuit board, and the connection structures are connected to a plurality of system connection structures of the system circuit board, the control device can transmit a test signal to perform a system-level test operation to the system circuit board and the chips under test.