Reusable Symmetrical Test Pins for Semiconductor Reliability Testing
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Solution Overview
Problem
Custom-made pins for high-power semiconductor devices are structurally complex, leading to high manufacturing costs and single-use limitations, necessitating a more efficient and cost-effective testing solution.
Innovation Solution
A semiconductor device testing equipment with symmetrical test pins having elastic structures that allow multiple uses by rotating around an axis, reducing manufacturing costs and improving test efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If custom-made pins with specialized structural designs are used, then test reliability is enhanced, but manufacturing period increases and production process becomes complex
Solution Approach 1:
The test pin is divided into multiple functional segments: a reusable pin body with contact structure, and replaceable pin covers. This segmentation allows the complex contact structure to be manufactured once and reused, while only the consumable covers need frequent replacement, reducing overall production complexity
Solution Approach 2:
The pin body is designed with universal features including an inclined axis structure and elastic contact elements that can accommodate different semiconductor device types. The symmetrical first and second contact structures allow the same pin body to be used for multiple testing configurations, reducing the need for custom-designed pins for each application
2Reliability
If custom-made pins with specialized structural designs are used, then test reliability is enhanced, but manufacturing cost increases
Solution Approach 1:
The design separates the expensive, complex pin body (which is recovered and reused) from the cheaper, simple pin covers (which are discarded after single use). This allows the high-cost reliable contact structure to be invested in once, while only low-cost consumable parts are replaced frequently, significantly reducing long-term manufacturing costs
Solution Approach 2:
The pin covers are designed as simple, inexpensive disposable components that can be easily manufactured and replaced. By making only the outer protective covers disposable rather than the entire pin assembly, the system maintains reliability through the reusable pin body while minimizing the cost of consumable parts
3Measurement precision
If custom-made pins are used, then testing accuracy is maintained, but the pins need to be discarded after single use
Solution Approach 1:
The pin incorporates an elastic contact structure with predetermined inclination that provides dynamic adaptability. The elastic element can deform to accommodate variations in device positioning and contact surface irregularities, maintaining consistent electrical contact and measurement accuracy across multiple uses of the same pin body
Solution Approach 2:
The pin body features an inclined axis structure where the first and second contact structures are positioned at specific asymmetric angles relative to the pin axis. This asymmetric geometry is engineered to optimize contact pressure distribution and electrical connection reliability, ensuring consistent testing accuracy while enabling the pin to be flipped and reused multiple times
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables multiple reliability tests with the same pins, reducing production time and costs while maintaining testing accuracy and quality.
Implementation Method 1
first to third elastic structures respectively extending along the plurality of test pins
Data Source
AI summary
A semiconductor device testing equipment comprises a test substrate having a first surface and a second surface opposing each other, and a plurality of substrate pads disposed on the first surface, a plurality of test pins respectively disposed on the plurality of substrate pads and supporting a semiconductor device, each of the test pins having first and second structures that are symmetrical with respect to an axis having a predetermined inclination from the first surface of the test substrate, and first to third elastic structures respectively extending along the plurality of test pins.