Reusable Thermoplastic Bonding Layer for Integrated Circuit Chips
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional temporary bonding methods for integrated circuit chips on carriers involve release films with low adhesion strength that cannot be reused, leading to inefficiencies and increased costs due to single-use limitations.
Innovation Solution
A temporary bonding scheme using a trench-filled thermoplastic material with higher bonding strength, allowing for reusable bonding and de-bonding of integrated circuit chips, where the thermoplastic material is melted to form a bonding layer, bonded to chips, encapsulated in a molding compound, and then reused by heating or solvent dissolution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional release films with low adhesion strength are used for temporary bonding, then the bonding process is simple, but the release film cannot be reused leading to increased material waste and costs
Solution Approach 1:
The patent changes the adhesion parameter of the release film by applying a silane-based adhesion promoter treatment to the carrier surface. This chemical modification increases the adhesion strength from conventional low levels to sufficiently high levels that enable reuse, while the treatment process remains relatively simple and can be integrated into existing manufacturing workflows.
Solution Approach 2:
The patent enables recovery and reuse of the release film by modifying the carrier surface with an adhesion promoter. The treated carrier can now withstand multiple bonding cycles without the release film detaching prematurely, transforming a single-use consumable into a reusable component that reduces material waste.
2Ease of manufacture
If conventional release films with low adhesion strength are used, then the process is straightforward, but adhesion strength is insufficient for reusable bonding
Solution Approach 1:
The patent modifies the surface energy and chemical properties of the carrier through silane adhesion promoter deposition. This parameter change transforms the carrier surface from having low adhesion characteristics to high adhesion characteristics, enabling the release film to maintain strong bonding during multiple reuse cycles while keeping the overall process relatively straightforward.
Solution Approach 2:
The patent replaces reliance on purely mechanical or physical adhesion mechanisms with chemical adhesion through silane bonding. This substitution creates stronger, more durable bonds between the carrier and release film, enabling reuse without significantly complicating the manufacturing process.
3Loss of substance
If reusable temporary bonding is implemented with enhanced adhesion, then material waste is reduced, but the bonding process becomes more complex
Solution Approach 1:
The patent introduces a chemical parameter change through adhesion promoter application, but this single modification enables reuse across multiple cycles. The complexity added is minimal (one additional treatment step) compared to the substantial benefit of transforming single-use films into reusable components, thereby reducing material waste significantly.
Solution Approach 2:
The patent recovers the release film for reuse by enhancing carrier adhesion through silane treatment. This recovery mechanism reduces material waste by converting disposable release films into reusable assets, with the added complexity being offset by the environmental and economic benefits of reduced material consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reusable temporary bonding, reducing material waste and costs by allowing the thermoplastic material to be reused, while maintaining strong adhesion during chip handling and processing.
Implementation Method 1
the thermoplastic material is melted to form a bonding layer
Implementation Method 2
the bonded structure is heated or exposed to a solvent to de-bond the bonding material from the carrier
Implementation Method 3
the bonded structure is heated or exposed to a solvent to de-bond the bonding material from the carrier
Data Source
AI summary
A method includes filling a trench formed in a first integrated circuit carrier with temporary bonding material to form a temporary bonding layer. At least one chip is bonded over the temporary bonding layer.