Reverse-Bonded Display Module for Narrow Bezels and Moisture Sealing
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Solution Overview
Problem
Existing display modules with flexible circuit boards occupy excessive space, leading to challenges in achieving a narrow frame design and are prone to corrosion due to moisture and oxygen ingress at bonding points.
Innovation Solution
The display module employs a reverse bonding structure with a flexible circuit board, utilizing adhesive layers and sealing portions to form a closed cavity, reducing space occupation and preventing moisture and oxygen ingress, thereby enhancing stability and durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a flexible circuit board is used in the display module, then the display apparatus can achieve diversified structural forms (folding, bending, sliding-rolling), but the module occupies excessive space making narrow frame design difficult
Solution Approach 1:
The patent applies nesting by placing the chip inside the bonding portion of the flexible circuit board, and positioning the bending portion within the display portion's boundary. This nested arrangement allows multiple components to occupy overlapping spatial projections, reducing the overall footprint of the display module while maintaining all necessary functional elements for flexible structural forms
Solution Approach 2:
The patent utilizes the third dimension (vertical stacking) by arranging components in different layers: the chip is embedded within the bonding portion, the bending portion is folded underneath the display portion, and sealing portions are positioned at different heights. This vertical arrangement allows components to coexist in overlapping horizontal projections without increasing the module's planar area, enabling narrow frame design
2Ease of manufacture
If bonding points are exposed in the display module, then assembly is simplified, but the module is prone to corrosion due to moisture and oxygen ingress
Solution Approach 1:
The patent applies preliminary anti-action by pre-positioning sealing portions at the bonding interfaces between components before the module is put into service. These sealing portions proactively block moisture and oxygen pathways at the bonding points, preventing corrosion before it can occur. The sealing structure is built in during assembly, creating a protective barrier that anticipates and prevents future environmental damage
Solution Approach 2:
The patent converts the potentially harmful exposure of bonding points into a benefit by using the bonding structure itself as part of the sealing system. The bonding portions and sealing portions are integrated such that the bonding interfaces, which would normally be vulnerable, become enclosed within sealed cavities. The bonding process creates the very structure that will be sealed, turning a weakness into a protected feature
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces space occupation, improves bonding stability, and enhances the display module's durability by preventing corrosion, facilitating a narrow frame design and improved waterproof performance.
Implementation Method 1
The adhesive layer is bonded between the first main body sub-portion and the second main body sub-portion
Implementation Method 2
Orthographic projections of the first sealing portion, the adhesive layer, the second sealing portion and the first bonding sub-portion on the display portion constitute a closed figure
Data Source
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AI summary
A display module, comprising: a display panel, the display panel comprising a display portion, a bending portion and a binding portion, connected in sequence, the binding portion comprising a first binding sub-portion and a first main body sub-portion connected to each other; a flexible circuit board, comprising a second binding sub-portion and a second main body sub-portion, connected to each other, an orthographic projection of the second binding sub-portion onto the display portion at least partially overlapping with an orthographic projection of the first binding sub-portion onto the display portion, and the second main body sub-portion being provided with a first opening; a chip, located in the first opening and electrically connected to the first main body sub-portion; a bonding layer, bonded between the first main body sub-portion and the second main body sub-portion; a first sealing portion, located in the first opening, the first sealing portion being connected to the bonding layer, the first main body sub-portion and the second main body sub-portion; a second sealing portion, located outside the first opening and connected to the bonding layer, the first binding sub-portion, the first main body sub-portion, the second binding sub-portion and the second main body sub-portion, orthographic projections of the first sealing portion, the bonding layer, the second sealing portion and the first binding sub-portion onto the display portion forming a closed shape.