Reverse Clamping Compression for CPO Optical Modules
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Solution Overview
Problem
Existing optoelectronic packaging technologies for Co-Packaged Optics (CPO) or Near Package Optics (NPO) face challenges in efficiently applying a strong downward locking force to optical modules while maximizing heat dissipation and maintaining the correct assembly sequence from top to bottom.
Innovation Solution
A reverse clamping compression device is introduced, featuring a mechanical bolster mounted on a main board, a compression cover covering optical modules on a mezzanine board, and a fastening system that includes floating standoffs, spring elements, and shoulder screws. This configuration applies compression force from above and utilizes space below the main board for spring elements, optimizing heat sink module placement and ensuring top-to-bottom assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If compression force is applied from above the optical modules, then the locking force to the LGA socket is improved, but the space above the compression cover is occupied, preventing optimal heat sink placement
Solution Approach 1:
The patent inverts the conventional compression direction by applying compression force from above while positioning the spring elements below the main board. This inversion allows the compression cover to press down on the optical modules from above (improving LGA socket connection) while the spring elements are relocated to the opposite side (below the board) to avoid occupying the space above the compression cover, thus resolving the spatial conflict for heat sink placement.
Solution Approach 2:
The patent moves the spring elements from the traditional position above the compression cover to below the main board, utilizing the vertical dimension on the opposite side of the assembly. This dimensional relocation allows both the compression function (from above) and the heat sink space (above compression cover) to coexist without interference.
2Force
If spring elements are placed above the compression cover to apply compression force, then the locking force is improved, but the heat conduct path of heat sink modules is lengthened
Solution Approach 1:
Instead of placing spring elements above the compression cover (conventional approach), the patent inverts the arrangement by positioning them below the main board. This inversion shortens the heat conduct path for heat sink modules that can now be placed directly above the optical modules without obstruction, while still achieving the required compression force through the inverted spring mechanism.
3Ease of manufacture
If the assembly is configured for top-to-bottom installation, then the assembly sequence is simplified, but the compression mechanism must occupy space that could be used for heat sinks
Solution Approach 1:
The patent maintains the simple top-to-bottom assembly sequence while inverting the position of spring elements to below the main board. This inversion resolves the space conflict by allowing heat sink modules to be placed above the compression cover during assembly, ensuring both ease of manufacture and optimal use of space for thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The reverse clamping compression device effectively applies clamping force to optical modules without occupying space above the compression cover, maximizing heat sink module space usage and significantly reducing the heat conduct path, while maintaining the correct assembly sequence.
Implementation Method 1
a spring element connected with the floating standoff and passing through the mechanical bolster and placed under the mechanical bolster
Data Source
AI summary
The present disclosure provides a reverse clamping compression device for CPO or NPO. The device includes a mechanical bolster placed on a main board, a compression cover covering optical modules, and a fastening connecting and fixing the compression cover to the mechanical bolster and protruding below the mechanical bolster. In the present disclosure, the compression cover above the optical modules is used to apply a compression force to the optical modules, and the spring element is placed in space below the main board, therefore, the space above the compression cover is not occupied, which can maximize the use of the space above the optical modules, greatly shorten the heat conduct path of the heat sink module, and ensure that the entire device is still assembled from top to bottom.