Heat Absorbing Or Dissipating Devices With Reverse-Flow Piping

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Solution Overview

Problem

Conventional heat absorbing or dissipating devices using thermal conductive fluids often create larger temperature differences at specific positions due to fixed flow directions, leading to non-uniform temperature distribution.

Innovation Solution

The use of multi-pipe systems where thermal conductive fluids are transported in reverse directions through parallel or quasi-parallel first and second fluid piping arrangements, allowing for uniform temperature distribution by reversing the flow of thermal conductive fluids to achieve heat absorption or dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If thermal conductive fluids are transported through single piping in fixed flow direction, then the device structure is simple, but larger temperature difference is formed at each position leading to non-uniform temperature distribution

Engineering Contradiction:
Improvetemperature distribution uniformityVSAvoidpiping arrangement complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The single fluid piping is segmented into at least two separate fluid piping passages (first fluid piping and second fluid piping), each transporting thermal conductive fluid in opposite directions. This segmentation allows different regions of the heat absorbing/dissipating body to receive fluids at different temperatures, achieving more uniform temperature distribution across the body.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent implements reverse flow arrangement where the first fluid piping and second fluid piping transport thermal conductive fluids in opposite directions through the heat absorbing/dissipating body. This inversion of the conventional single-direction flow creates temperature compensation effects that uniformize the temperature distribution across the device.

Inventive Principle:
Principle #13The other way round (Inversion)

2Temperature

If thermal conductive fluids are transported in reverse directions through multi-pipe systems, then uniform temperature distribution is achieved, but the device structure becomes more complex

Engineering Contradiction:
Improvetemperature distribution uniformityVSAvoidmulti-pipe system complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent merges the functions of multiple fluid passages into an integrated heat absorbing/dissipating body structure. The first and second fluid piping are arranged in parallel or quasi-parallel configurations within the same structural framework, sharing common inlet/outlet connections and structural support, thereby reducing overall system complexity despite the multi-pipe arrangement.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The heat absorbing/dissipating body serves multiple functions simultaneously: it acts as the structural housing, the heat transfer medium container, and the thermal exchange surface. The fluid piping system is designed to accommodate both heating and cooling operations by simply reversing fluid flow directions, providing universal functionality without requiring separate systems.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in a more uniform temperature distribution across the heat absorbing or dissipating body, effectively addressing the issue of localized temperature extremes by ensuring thermal energy is evenly transferred.

Implementation Method 1

passing through thermal conductive fluid as the heat absorbing or dissipating body

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 2

thermal conductive fluids in temperature difference to the passively heat dissipation or absorption receiving article or space

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP2192369B1Heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids
Publication Date: 2020.03.18 YANG TAI HER
  • EP2192369B1 patent drawingFigure 1~2
  • EP2192369B1 patent drawingFigure 3~4
  • EP2192369B1 patent drawingFigure 5~6

AI summary

The present invention relates to the thermal conductive fluids in temperature difference reversely transported by the first fluid piping and second fluid piping in parallel or quasi-parallel arrangement on the same end side to produce heat absorbing or dissipating function onto the passively heat dissipation or absorption receiving article or space thereby forming a more uniform temperature distribution status on the heat absorbing or dissipating body (100) or the passively heat dissipation or absorption receiving article or space (200).