Reverse Funnel Test Handler Head for Semiconductor Alignment
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Solution Overview
Problem
Current handler mechanisms for integrated circuit devices face challenges in aligning devices with varying tolerances, leading to electrical failures and increased productivity losses due to misalignment and jamming issues, as they rely on fixed opening dimensions that cannot accommodate the full range of package size tolerances.
Innovation Solution
A test head with a plunger featuring a funnel alignment portion having sloped inner walls and a vacuum pad, which centers the device within the plunger, allowing for better alignment and secure holding, regardless of the device's size within the tolerance range, and a separate funnel insert with a spring mechanism to absorb excess impact and prevent damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a fixed opening dimension on the plunger vertical wall is used to align devices, then alignment precision can be improved for devices at the nominal tolerance, but devices with tolerances outside the nominal range will experience misalignment or jamming
Solution Approach 1:
The plunger vertical wall is changed from a fixed rigid structure to a compliant structure that can dynamically adjust its position. The wall includes a compliant portion that deflects under device contact, allowing the opening dimension to effectively vary and accommodate different package sizes within the tolerance range while maintaining proper alignment
Solution Approach 2:
The opening dimension of the plunger is changed from a fixed parameter to a variable parameter that can adjust based on device characteristics. The compliant portion allows the effective opening size to change, enabling the same plunger to work with devices across the full tolerance range without requiring multiple fixed-dimension plungers
2Reliability
If the plunger cavity is made large enough to accommodate devices at the high side of tolerance, then fewer devices will be stuck, but devices at the low side of tolerance will experience misalignment and continuity failures
Solution Approach 1:
The compliant portion of the vertical wall dynamically adjusts its position based on the device size. For larger devices, the wall deflects outward to prevent sticking, while for smaller devices, it maintains a tighter fit to ensure proper alignment, thus adapting to different device dimensions within the same plunger structure
Solution Approach 2:
The compliant portion automatically adjusts its configuration based on the device inserted, without requiring external control or adjustment mechanisms. The deflection is self-regulating, providing the appropriate clearance or fit based on the device dimensions encountered
3Manufacturing precision
If the plunger cavity is made small to accommodate devices at the low side of tolerance, then alignment precision improves, but devices at the high side of tolerance will jam in the handler mechanism
Solution Approach 1:
The vertical wall transitions from a static fixed-dimension barrier to a dynamic compliant structure that can deflect to accommodate larger devices. This prevents jamming in the handler mechanism while maintaining the alignment precision needed for smaller devices, as the wall adapts its effective position based on device size
4Manufacturing precision
If tighter device body package tolerance is controlled, then alignment precision improves, but assembly yield decreases and cost increases due to higher scrappage
Solution Approach 1:
The system changes from requiring tight device tolerance control to using a compliant plunger structure that can adapt to the full tolerance range. This parameter change in the plunger's rigidity allows acceptance of devices across the full specification range, improving yield without sacrificing alignment precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures accurate device alignment and secure holding, reducing electrical failures and jamming issues, while allowing for the handling of devices with varying dimensions within the tolerance range, thereby improving productivity and reducing scrap rates.
Implementation Method 1
a vacuum pad extending through the channel of the plunger and the funnel alignment portion, the vacuum pad being configured to contact an upper surface of the semiconductor device and supply a vacuum to hold the semiconductor device in the test head
Data Source
AI summary
A test head for a semiconductor device handler includes a plunger; and a funnel insert attached to the plunger via a funnel insert spring, the funnel insert having a channel extending axially therethrough, and the funnel insert including a plurality of sloped inner walls that are sloped outwardly in a distal direction of the funnel insert and configured to contact upper edges of a semiconductor device to center the semiconductor device in the funnel insert. The plunger includes a projecting portion that extends through the channel of the funnel insert. When the spring is in an uncompressed state, a distal end of the funnel insert extends past a distal end of the projecting portion of the plunger.