High-Definition Metal Pattern via Reverse Offset Printing
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Solution Overview
Problem
Current methods for forming high-definition metal patterns, such as photolithography, are costly, environmentally impactful, and limited by productivity, while printing methods fail to achieve the same level of definition and adhesion required for electronic components.
Innovation Solution
A method involving reverse offset printing of a plating-core ink on a specific resin layer, followed by electroless plating, to create a high-definition metal pattern with improved cross-sectional shape and interlaminar adhesion, using a resin composition with urethane or vinyl resins and a medium to form a receiving layer on a substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photolithography is used to form high-definition metal patterns, then manufacturing precision is improved, but device complexity and capital investment increase
Solution Approach 1:
The invention extracts and eliminates unnecessary process steps from the conventional photolithography method. By using direct printing of plating-core ink followed by electroless plating, it removes the resist application, exposure, and etching steps, thereby simplifying the production process while maintaining high-definition metal pattern formation
Solution Approach 2:
The printing method serves multiple functions simultaneously: it patterns the plating-core material, defines the metal pattern geometry, and creates the necessary adhesion layer, replacing multiple separate functions performed by different steps in photolithography
2Manufacturing precision
If photolithography is used to form high-definition metal patterns, then manufacturing precision is improved, but productivity decreases
Solution Approach 1:
The invention enables continuous production by eliminating the sequential, time-consuming steps of resist application, exposure, and development. The printing method allows direct deposition of plating-core ink followed immediately by electroless plating, creating a continuous production flow that maintains high definition while improving productivity
3Device complexity
If printing method is used to form metal patterns, then device complexity is reduced, but manufacturing precision deteriorates
Solution Approach 1:
The invention changes the physical and chemical parameters of the printing process to achieve high definition. By controlling the plating-core ink formulation, printing parameters, and electroless plating conditions, it attains metal pattern definition comparable to photolithography while maintaining process simplicity
Solution Approach 2:
The invention uses composite plating-core ink formulations that combine binding agents, plating catalysts, and metal particles. This composite material approach enables the printing method to achieve high-definition metal patterns with good adhesion and uniform thickness, resolving the precision issue while keeping the process simple
4Ease of manufacture
If screen printing or IJ printing is used to form plating-core patterns, then ease of manufacture is improved, but manufacturing precision deteriorates due to undulations
Solution Approach 1:
The invention introduces a receiving layer as an intermediary between the substrate and the plating-core pattern. This receiving layer, formed by coating with a specific resin composition, provides a smooth surface that eliminates the undulations caused by screen printing or IJ printing, thereby improving the cross-sectional shape of the metal pattern while maintaining ease of manufacture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of high-definition metal patterns with good cross-sectional shape and adhesion, comparable to photolithography, while reducing costs and environmental impact, and enhancing productivity.
Implementation Method 1
depositing a metal on the plating-core pattern formed in step (2) by electroless plating
Data Source
AI summary
Provided are a method for forming a high-definition metal pattern which including the steps of (1) forming a receiving layer on a substrate by coating the substrate with a resin composition including a urethane resin having a weight-average molecular weight of five thousand or more or a vinyl resin and a medium, (2) forming a plating-core pattern on the receiving layer by printing an ink including a particle that serves as a plating core on the receiving layer by reverse offset printing, and (3) depositing a metal on the plating-core pattern by electroless plating, a high-definition metal pattern formed by the above-described method, and an electronic component including the high-definition metal pattern.