Reverse Pattern Transfer via Imprint Resin and Adhesive Film

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Solution Overview

Problem

Conventional nano imprint processes struggle to effectively transfer patterns with top areas larger than bottom areas or onto curved surfaces, as they fail to accurately replicate the reverse pattern of a master mold onto a transfer substrate.

Innovation Solution

A method involving a master mold with a first pattern, coated with imprint resin and pressed by a stamp member to form a second pattern with a reverse shape, which is then transferred onto a substrate by attaching and separating the stamp member using a pressure-sensitive adhesive film and adhesive layers, allowing for the removal of residual resin and efficient pattern transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a conventional nano imprint process is used to transfer patterns, then patterns with standard geometries can be formed, but patterns with top areas larger than bottom areas or curved surfaces cannot be effectively transferred

Engineering Contradiction:

Improvepattern transfer capabilityVSAvoidpattern replication accuracy

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent inverts the conventional imprinting approach by forming the reverse pattern directly on the transfer substrate instead of creating a positive pattern on a stamp mold. The imprint resin is cured while in contact with the master mold, then the uncured resin is removed to reveal the reverse pattern, enabling direct transfer of inverted geometries including overhangs and curved surfaces without requiring intermediate stamp molds

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The patent extracts and removes the uncured imprint resin from between the master mold and transfer substrate after curing. By selectively removing only the uncured resin portions (which correspond to the pattern spaces), the reverse pattern is revealed directly on the transfer substrate, enabling formation of complex geometries that cannot be achieved through conventional stamping

Inventive Principle:

Principle #2Taking out (Extraction)

2Manufacturing precision

If multiple imprint processes are used to transfer patterns through intermediate stamp molds, then pattern transfer can be achieved, but the number of process steps increases

Engineering Contradiction:

Improvepattern transfer accuracyVSAvoidprocess efficiency

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The patent combines the pattern formation and transfer steps into a single integrated process. The imprint resin is coated, cured in contact with the master mold, and then the reverse pattern is directly transferred to the transfer substrate in one sequence, eliminating the need for separate stamp mold fabrication and transfer steps required in conventional multi-step processes

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent performs preliminary curing of the imprint resin while it is still in position between the master mold and transfer substrate. This preliminary action allows the pattern to be formed and transferred simultaneously, rather than requiring separate steps for pattern formation on an intermediate mold followed by transfer to the final substrate

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables the direct transfer of reverse patterns onto substrates with curved surfaces and reduces the number of imprint processes required, effectively handling patterns with varying surface areas and shapes, and facilitates efficient etching as a hard mask.

Implementation Method 1

a fluidic imprint resin fills an empty space in the mold due to a capillarity phenomenon

Methodology Applied

Scientific EffectCapillarity phenomenon: Capillary Action

Implementation Method 2

The imprint resin is cured by light irradiated thereon and then the mold is removed to form a pattern on the substrate

Methodology Applied

Scientific EffectPhoto-curing: Photopolymerisation

Implementation Method 3

the stamp member may include a pressure-sensitive adhesive ('PSA') film

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS10185218B2Method of transferring reverse pattern by using imprint process

Publication Date: 2019.01.22 SAMSUNG ELECTRONICS CO LTD

AI summary

A method of transferring a reverse pattern using an imprint process includes: preparing a master mold, where a first pattern is defined on a surface of the master mold; coating an imprint resin on the master mold to cover the first pattern; pressing the imprint resin toward the master mold using a stamp member; curing the imprint resin to form a second pattern between the master mold and the stamp member, where the second pattern has a reverse shape to a shape of the first pattern; detaching the stamp member from the master mold to separate the second pattern from the master mold; and transferring the second pattern onto a transfer substrate.