Reverse Tapered Lid Body for Electronic Device Package Mounting
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Solution Overview
Problem
Existing electronic device packages face challenges in increasing the mounting ratio of electronic device components due to limited space and height constraints, with previous designs limiting the size of components that can be mounted and reducing the reliability of connections between the lid body and base portions.
Innovation Solution
The design incorporates a lid body portion with a concave structure featuring a reverse tapered side-plate inner surface, thinner side and bottom plate thicknesses, and a flange portion with a specific radius configuration to maximize space and prevent component contact, while ensuring reliable bonding and reduced package size and height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the package size and height are reduced to meet miniaturization requirements, then the electronic device becomes more compact, but the mounting ratio of electronic device components decreases
Solution Approach 1:
The patent inverts the conventional tapered structure by making the side-plate inner surface incline outward from the opening toward the bottom, creating a reverse tapered shape that expands the internal housing space rather than reducing it, thereby maintaining high mounting ratio in miniaturized packages
Solution Approach 2:
The patent utilizes the height dimension effectively by creating a reverse tapered side-plate structure that expands space vertically, allowing larger component mounting area without increasing the planar footprint of the package
2Device complexity
If a conventional tapered side-plate structure is used, then the lid body structure is simple, but the internal housing space is reduced and components may contact the lid body
Solution Approach 1:
The patent inverts the conventional tapered side-plate structure by making the side-plate inner surface incline outward from the opening toward the bottom, creating a reverse tapered shape that expands the internal housing space rather than reducing it, thereby maintaining high mounting ratio in miniaturized packages
Solution Approach 2:
The reverse tapered structure proactively prevents component contact with the lid body by creating an outward incline that maintains clearance, eliminating the need for additional spacing considerations in component placement
3Reliability
If the flange portion thickness is increased to improve bonding reliability, then the connection between lid body and base portion is more reliable, but the package height increases
Solution Approach 1:
The patent optimizes the flange portion thickness to a specific range (0.02-0.20mm) and controls the radius ratio (r1/r2 between 0.05 and 0.50) to achieve adequate bonding reliability while minimizing package height, demonstrating parameter optimization to resolve the contradiction
Data Source
AI summary
To provide a lid body portion with an improved mounting ratio of an electronic device component, an electronic device package and an electronic device including the same. There is provided a lid body portion including a concave portion in which a space portion is formed by a bottom portion and a side plate portion and a flange portion extending from an outer edge portion in an opening portion of the concave portion to the outside, in which a side-plate inner surface as a surface facing the space portion of the concave portion in the side plate portion inclines to the outside of the space portion.