Reverse Wedgelock Device for Thermal Contact
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Solution Overview
Problem
Existing cooling methods for electronic components, such as edge cooling, are inefficient in dissipating heat generated by powerful computing systems, leading to overheating and potential component failure due to inadequate thermal interface and high forces required to maintain contact between cold plates and electronic components.
Innovation Solution
The reverse wedgelock device applies an internal pulling force through a lead screw mechanism to draw components together, ensuring uniform contact and thermal interface without occupying valuable surface space or exerting damaging forces, using a chain of draw blocks with wedge surfaces and anchors to secure and compress the components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional wedgelocks are used to apply external pressure on electronic components, then thermal contact between components and cooling plates is improved, but the working space becomes constrictive and access is difficult
Solution Approach 1:
The patent inverts the traditional wedgelock mechanism by using an internal pulling force instead of external pressure. The lead screw mechanism draws the electronic component and cooling plate together from the inside, reversing the direction of force application. This inversion eliminates the need for constrictive external pressure while maintaining effective thermal contact between surfaces.
Solution Approach 2:
The patent transitions from a two-dimensional surface pressure approach to a three-dimensional volumetric drawing mechanism. By using the lead screw to pull components together through the depth of the assembly, the invention creates force distribution throughout the volume rather than just at the surfaces, improving access while maintaining contact.
2Reliability
If high forces are applied to maintain contact between cold plates and electronic components, then thermal efficiency is improved, but component damage risk increases
Solution Approach 1:
The patent changes the force application parameter from high-magnitude concentrated pressure to low-magnitude distributed tension. The lead screw mechanism applies a continuous pulling force that distributes stress evenly across the component structure, maintaining the necessary contact pressure for thermal efficiency while preventing localized stress concentrations that could cause damage.
Solution Approach 2:
The patent incorporates a gradual force application mechanism through the lead screw threading, which allows for controlled, progressive drawing of components together. This prevents sudden force application that could cause shock damage, while the distributed anchor points provide cushioning against excessive force concentration at any single location.
3Device complexity
If traditional cooling methods are used, then device simplicity is maintained, but heat dissipation efficiency is insufficient for high-power systems
Solution Approach 1:
The patent introduces the lead screw mechanism as an intermediary device that enables effective thermal contact without requiring complex external pressing systems. This simple mechanical intermediary translates rotational motion into linear drawing force, achieving high thermal efficiency while maintaining overall system simplicity through a single, integrated mechanism.
4Reliability
If external pressing mechanisms are used to ensure thermal contact, then contact pressure is improved, but space occupation increases
Solution Approach 1:
The patent nests the lead screw mechanism within the existing component assembly, utilizing the internal volume of the electronic component housing rather than requiring external space. The drawing mechanism is contained within the boundaries of the component itself, eliminating the need for additional external pressing structures and reducing overall space occupation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances thermal efficiency by maintaining consistent contact between cold plates and electronic components, preventing overheating and component failure while optimizing space usage and force distribution, thereby improving cooling performance in high-power computing systems.
Implementation Method 1
The reverse wedgelock device can comprise a lead screw configured to pass through each of the draw blocks and the stationary draw block
Implementation Method 2
Each draw block can comprise a wedge surface configured to abut an opposing wedge surface of an adjacent draw block
Data Source
AI summary
A reverse wedgelock device with multiple draw blocks disposed about a lead screw passing through the draw blocks, wherein the draw blocks may be compressed together and caused to displace about respective wedge surfaces upon tightening of the screw. Compression and displacement of the draw blocks can function to draw anchors associated with the draw blocks inward, which, when engaged with opposing objects, functions to draw the objects together.