Reversible-Bond Curable Resin for Repairable, Remoldable Products
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Solution Overview
Problem
Existing epoxy resin-based cured products lack long-term reliability, recyclability, and are not easily repairable or remoldable, leading to environmental waste and limited recyclability of adhesives.
Innovation Solution
A hydroxyl group-containing compound with specific structural units linked by reversible bonds having a dissociation temperature of 120°C or higher, incorporated into a curable resin composition, allowing for repairability and remoldability through reversible bonds such as Diels-Alder reactions and disulfide bonds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If epoxy resin is used to obtain cured products with excellent heat resistance and mechanical strength, then the cured product has good performance, but it becomes insoluble and不可 recyclable after use
Solution Approach 1:
The patent changes the chemical parameters of the resin system by combining epoxy resin with thermoplastic resin and reactive adhesive components. This creates a dual-network structure where the epoxy provides heat resistance and mechanical strength, while the thermoplastic segments provide melt-processability for recycling. The reactive adhesive components form dynamic bonds that allow the material to be reprocessed while maintaining performance.
Solution Approach 2:
The invention creates a composite material system combining epoxy resin, thermoplastic resin, and reactive adhesive components. This composite structure allows the material to exhibit both the heat resistance and mechanical strength of epoxy resin and the recyclability of thermoplastic materials, resolving the contradiction between performance and environmental compatibility.
2Reliability
If thermosetting resin is used to achieve good adhesive properties, then the cured product has excellent adhesion, but it cannot be disassembled or repaired after deterioration
Solution Approach 1:
The patent introduces dynamic and reversible bonding mechanisms through reactive adhesive components that can form and break bonds under specific conditions. This allows the adhesive to maintain strong bonding during service while enabling disassembly and repair when needed, transforming the static, irreversible nature of traditional thermosetting adhesives into a dynamic system.
Solution Approach 2:
The invention changes the chemical and physical parameters of the adhesive system by incorporating reactive adhesive components with specific functional groups that enable reversible bonding. This allows the adhesive to transition between bonded and unbonded states, providing both strong adhesion and ease of repair.
3Strength
If traditional curable resin is used to ensure mechanical strength, then the cured product has good strength, but it lacks repairability and remoldability
Solution Approach 1:
The patent creates a composite resin system combining traditional curable resin with thermoplastic resin and reactive adhesive components. This composite structure allows the material to exhibit both the mechanical strength of curable resin and the repairability/remoldability of thermoplastic materials, resolving the contradiction between strength and reprocessability.
Solution Approach 2:
The invention introduces dynamic bonding mechanisms that allow the resin to maintain strong mechanical properties during service while enabling repair and remolding when needed. The reactive adhesive components form bonds that can be broken and reformed, providing both strength and reprocessability.
4Duration of action of stationary object
If epoxy resin cured product is used to achieve long service life, then the cured product has good durability, but it generates waste and is not environmentally friendly
Solution Approach 1:
The patent changes the fundamental parameters of the resin system by incorporating thermoplastic components and reactive adhesive mechanisms that enable recycling and reuse. This transforms the traditionally linear (produce-use-dispose) lifecycle into a circular economy model where materials can be recovered and reprocessed, reducing environmental waste while maintaining service life.
Solution Approach 2:
The invention enables the recovery and reuse of adhesive materials through its composition of thermoplastic resin and reactive adhesive components. When the adhesive reaches the end of its service life, it can be heated to melt the thermoplastic segments, allowing the material to be recovered, reprocessed, and reused, thereby reducing environmental waste.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cured product exhibits repairability and remoldability, extending its service life and reducing waste by enabling easy disassembly and reuse.
Implementation Method 1
the reversible bond is any one of an addition-type structure by a Diels-Alder reaction, a disulfide bond, an ester bond, a boronic acid ester bond, a hemiaminal bond, an imine bond, an acylhydrazone bond, an olefin metathesis reaction, an alkoxyamine skeleton, and an amide bond
Implementation Method 2
the reversible bond is an addition-type structure by an anthracene-type Diels-Alder reaction or a disulfide bond sandwiched between aromatic rings
Data Source
AI summary
There is provided a compound which, while being a curable resin, can easily exhibit repairability and remoldability when being in the form of a cured product, a curable resin composition obtained using the same; and a cured product thereof. A hydroxyl group-containing compound is used, in which a structural unit A having one or more hydroxyl groups and a structural unit B different from the structural unit A are linked in A-B-A, and the structural unit A and the structural unit B are bonded by a reversible bond having a dissociation temperature of 120° C. or higher. This reversible bond is preferably an addition-type structure formed by an anthracene-type Diels-Alder reaction or a disulfide bond sandwiched between aromatic rings.