Reversible CCD Imaging Device for High-Speed TDI Operations

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Solution Overview

Problem

Conventional solid-state imaging devices require significant time for imaging large areas due to the fixed direction of charge transfer in CCDs, necessitating device movement to capture images from one end to the other and back, which prolongs the imaging process.

Innovation Solution

A solid-state imaging device with first and second signal readout circuits at each end of the column direction, connected to semiconductor elements for serial signal output, allowing for reversible CCD charge transfer direction, enabling high-speed and low-noise readout and reducing the need for device movement during TDI operations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the CCD charge transfer direction is fixed, then the device structure is simple, but the imaging time for large areas increases significantly

Engineering Contradiction:
Improveimaging speedVSAvoiddevice structure
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The imaging device is segmented into multiple independent charge transfer paths with separate readout circuits. The pixel array is divided into first and second regions, each with its own charge transfer path and readout circuit, allowing parallel or alternating operation to image large areas faster without requiring a single complex movable structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces dynamic switching capability between fixed charge transfer directions. By using a transfer control circuit that can dynamically select between first and second charge transfer paths, the system achieves adaptive imaging without mechanical movement, resolving the contradiction between fixed structure and flexible imaging requirements.

Inventive Principle:
Principle #15Dynamics

2Area of stationary object

If the solid-state imaging device moves to capture images from one end to the other, then the imaging coverage increases, but the imaging time prolongs

Engineering Contradiction:
Improveimaging coverageVSAvoidimaging time
Core Design Contradiction:
Area of stationary objectVSLoss of time

Solution Approach 1:

The pixel array is segmented into first and second regions that can be imaged simultaneously or alternately through separate charge transfer paths. This allows the device to cover large areas without mechanical movement, as multiple regions are processed in parallel or rapid succession, eliminating the time loss associated with moving the device between imaging positions.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent enables continuous imaging of large areas by maintaining active charge transfer and readout operations across multiple pixel regions without interruption. The transfer control circuit ensures that while one region is being read out, another region can begin charge transfer, creating a continuous imaging process that eliminates idle movement time.

Inventive Principle:
Principle #20Continuity of useful action

3Productivity

If readout circuits are arranged at one end only, then the device structure is simple, but the readout noise increases and speed decreases

Engineering Contradiction:
Improvereadout speedVSAvoidcircuit arrangement
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The readout function is segmented into multiple independent readout circuits distributed at different ends of the pixel array. Instead of all signals converging at one end, the first and second readout circuits are positioned at opposite ends, allowing signals to be read out in parallel from multiple locations, thereby increasing readout speed without significant structural complexity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from a one-dimensional readout architecture (all signals to one end) to a two-dimensional readout architecture (signals to multiple ends). By distributing readout circuits across different spatial locations in the pixel array, the system achieves faster readout speeds and reduced noise through parallel processing, with the added complexity being minimal and well-justified by the performance gains.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows for efficient imaging of large areas with high spatial resolution in a shorter time by reversing the CCD charge transfer direction, reducing the time required for imaging and enabling coincident transfer speed and direction with moving subjects.

Implementation Method 1

a CCD-type solid-state imaging element (10) having an imaging plane (12) formed of M x N pixels (13) two-dimensionally arrayed in M rows and N columns

Methodology Applied
Scientific EffectPhotoelectric effect: Photoelectric Effect

Data Source

PatentUS9305969B2Solid-state imaging device operable with two readout modes in two different directions coincident with a moving speed and a moving direction of a moving subject
Publication Date: 2016.04.05 HAMAMATSU PHOTONICS KK
  • US9305969B2 patent drawing
  • US9305969B2 patent drawing
  • US9305969B2 patent drawing

AI summary

A solid-state imaging device 1A includes a CCD-type solid-state imaging element 10 having an imaging plane 12 formed of M×N pixels that are two-dimensionally arrayed in M rows and N columns, N signal readout circuits 20 arranged on one end side in the column direction for each of the columns with respect to the imaging plane 12, and N signal readout circuits 30 arranged on the other end side in the column direction for each of the columns with respect to the imaging plane 12, a semiconductor element 50 for digital-converting and then sequentially outputting as serial signals electrical signals output from the signal readout circuits 20 for each of the columns, and a semiconductor element 60 for digital-converting and then sequentially outputting as serial signals electrical signals output from the signal readout circuits 30 for each of the columns.