Reversible DC-DC Converter Thermal Management via Insulated Metal Substrate
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Solution Overview
Problem
Existing reversible DC/DC power converters face challenges with heat dissipation and cost due to the use of through-hole components on insulated metal substrates, which are difficult to solder and require additional components for voltage adaptation, leading to increased complexity and cost in dual-voltage motor vehicle networks.
Innovation Solution
A reversible DC/DC power converter design where surface-mounted components and through-type electronic elements are integrated on an insulated metal substrate, with solder caps used to securely attach through-hole components, allowing for selective wave soldering or laser welding, reducing the need for external intermediate parts and enabling standardization across various voltage ranges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through-hole components are used on insulated metal substrate, then electrical connection is achieved, but manufacturing difficulty and cost increase due to soldering challenges
Solution Approach 1:
The patent introduces an intermediate metalization layer between the through-hole component pins and the insulated metal substrate. This intermediate layer acts as a mediator that facilitates reliable electrical connection while enabling standardized soldering processes. The intermediate layer is deposited in the through-holes and provides a solderable surface that bridges the connection between component pins and substrate traces, resolving the manufacturing difficulty without compromising connection reliability.
2Reliability
If through-hole components are soldered on insulated metal substrate, then electrical connection is established, but heat dissipation performance deteriorates due to additional thermal resistance
Solution Approach 1:
The patent modifies the thermal and electrical parameters of the substrate by incorporating copper through-holes with specific dimensions and metallization layers. The copper material and optimized hole geometry change the thermal conductivity parameter, creating low-thermal-resistance pathways that conduct heat away from mounted components. This parameter optimization allows simultaneous achievement of reliable electrical connection and improved heat dissipation performance.
3Adaptability or versatility
If external intermediate parts are used for connecting through-hole components, then voltage adaptation is achieved, but device complexity increases
Solution Approach 1:
The patent merges the voltage adaptation function with the substrate structure itself. By integrating copper through-holes and intermediate metalization layers directly into the insulated metal substrate, the substrate simultaneously serves as both the mechanical support and the voltage adaptation interface. This eliminates the need for separate external intermediate parts, reducing device complexity while maintaining voltage adaptation capability across different configurations (12V to 48V, 12V to 120V).
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation, reduces manufacturing costs, and allows for modular scalability across different voltage networks (12V to 120V) by integrating chokes and capacitors directly on the substrate, improving efficiency and reducing self-heating issues.
Implementation Method 1
This technology, which is in itself well known for the production of electronic modules with conventional surface-mounted components (CMS), has been adapted by the company VALEO ELECTRONIQUE to the assembly of connectors... use the technology of insulated metal substrates (SMI) which allows better heat dissipation
Implementation Method 2
solder caps used to securely attach through-hole components, allowing for selective wave soldering or laser welding
Implementation Method 3
solder caps used to securely attach through-hole components, allowing for selective wave soldering or laser welding
Data Source
Figure 1~2
Figure 3a~3c
Figure 4
AI summary
The converter according to the invention comprises electronic components (11, 13) mounted on a substrate (4) and electronic elements (2, 3) comprising feed-through connector pins. The electronic components comprise semiconductor switch elements (11, 13) and the electronic elements comprise inductors (2) and/or capacitors (3). According to the invention, first semiconductor elements (11), switching a first voltage, are disposed on a first side portion (12) of the substrate (4) and form a first module, and second semiconductor elements (13), switching a second voltage, are mounted on a second side portion (14) of the substrate and form a second module. Moreover, the electronic elements (2, 3) are disposed under a middle portion (15) of the substrate, between the first and second side portions (12, 14), and form an intermediate module.