Reversible Semiconductor Die Pad Layout for Package Adaptability
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Solution Overview
Problem
Semiconductor dies require different die pad layouts to accommodate various packaging types, leading to assembly risks and increased costs due to the need for long or crossed bond wires, which complicates the assembly process and reduces efficiency.
Innovation Solution
A semiconductor die with a reversible die pad layout, where connecting lines electrically connect pairs of bonding pads, allowing the die to be used in different package types without the need for long or crossed bond wires, by maintaining a standardized pin arrangement and enabling attachment to either the top or bottom of a lead frame.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If different die pad layouts are used to accommodate various package types, then adaptability to different packaging formats is improved, but device complexity and manufacturing costs increase
Solution Approach 1:
The die pad layout is designed with symmetric connectivity patterns that allow the same die to be used in multiple package types (TSSOP, DFN, etc.) without requiring different layouts. The bonding pads are arranged and connected such that the die can be flipped or rotated to accommodate different package configurations, making a single die design universal across multiple packaging formats.
Solution Approach 2:
The patent employs asymmetric bonding pad arrangements that, when combined with strategic connecting lines, create a reversible layout. By carefully positioning pads and connections asymmetrically, the die can be oriented in different directions (flipped or rotated) to match different package pin assignments, enabling one layout to serve multiple package types.
2Adaptability or versatility
If long or crossed bond wires are used to connect die pads to leads, then adaptability to different package types is improved, but assembly risks and manufacturing precision requirements increase
Solution Approach 1:
The bonding pads are strategically positioned and connected locally on the die surface to minimize wire lengths. By optimizing the local arrangement of pads and their interconnections, the die reduces the need for long or crossed bond wires when adapted to different package types, thereby lowering assembly risks and precision requirements.
3Adaptability or versatility
If multiple versions of the same die with different pad layouts are provided, then adaptability to different package types is improved, but manufacturing costs and loss of substance increase
Solution Approach 1:
The die is designed with a universal bonding pad layout that can be used across multiple package types, eliminating the need to manufacture separate die versions for different packages. This single universal design reduces production costs by using the same manufacturing process and materials for all package variants.
Solution Approach 2:
The patent merges the functionality of multiple die layouts into a single unified design. By combining the characteristics needed for different package types into one reversible layout, the invention eliminates redundant manufacturing of multiple die versions, thereby reducing material waste and production costs.
Data Source
AI summary
A semiconductor die has internal circuitry formed on two more internal layers, and die bonding pads arranged on a top surface of the die. The bonding pads are connected to the internal circuitry for providing input and output signals to the internal circuitry. One or more connecting lines electrically connect one or more pairs of the die bonding pads, thereby defining a bonding pad layout. The die bonding pads are arranged and connected with the connecting lines such that the bonding pad layout is reversible, which allows the die to be used in different package types (e.g., TSSOP or DFN) yet maintain a standardized pin arrangement without the necessity for long or crossed bond wires.