Reversible Microfluidic Chip with Layered Epoxy Sealing
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Solution Overview
Problem
Conventional microfluidic chips are difficult to seal reversibly, limiting their reuse and ability to operate under high pressures, and they often lack the flexibility to accommodate samples that require real-time monitoring and high aspect ratios.
Innovation Solution
A reversible microfluidic chip design featuring a layered structure with a rigid epoxy polymer first layer and a flexible epoxy polymer second layer, allowing for quick and repeated opening and closing, and enabling operation at higher pressures while maintaining chemical resistance and self-repair capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional microfluidic chips are sealed using silicon or glass, then high pressure resistance and chemical resistance are improved, but reversibility of sealing and ease of operation deteriorate
Solution Approach 1:
The chip is divided into a permanent base part and a removable cover part. The cover part can be detached and reattached multiple times, enabling reversible sealing while maintaining high pressure resistance when closed. This segmentation allows the chip to function as a single integrated unit during operation but can be easily opened for sample introduction and reused.
Solution Approach 2:
The sealing interface utilizes surface energy parameter changes through plasma treatment or chemical functionalization of the sealing surfaces. This creates reversible adhesion that is strong enough to withstand high pressures during operation but can be easily reversed by simple mechanical separation, enabling multiple opening/closing cycles without compromising seal integrity.
2Reliability
If conventional microfluidic chips are sealed using silicon or glass, then chemical resistance is improved, but reversibility of sealing and manufacturing complexity deteriorate
Solution Approach 1:
The sealing surfaces are treated with plasma or chemical functionalization to modify surface energy parameters, creating reversible adhesion. This approach maintains chemical resistance of the base materials while enabling simple, reversible sealing mechanisms that do not require complex assembly procedures or specialized equipment.
3Strength
If conventional microfluidic chips are sealed using silicon or glass, then high pressure resistance is improved, but ease of manufacture and cost deteriorate
Solution Approach 1:
The chip is divided into a permanent base part and a removable cover part that can be separately manufactured using cost-effective methods such as molding or 3D printing. This segmentation allows the use of simpler, less expensive manufacturing processes while maintaining high pressure resistance when the parts are assembled and sealed together.
Solution Approach 2:
The removable cover part can be designed as a disposable or reusable component that is inexpensive to manufacture. Multiple identical covers can be produced using simple molding techniques, reducing the overall cost of the chip system while maintaining the performance of the permanent base part.
4Shape
If conventional microfluidic chips are sealed using silicon or glass, then high aspect ratio channels are achieved, but reversibility and ease of operation deteriorate
Solution Approach 1:
The chip is divided into a permanent base part containing the high aspect ratio channels and a removable cover part. This segmentation allows the channels to be formed in the rigid base structure with high aspect ratios for improved flow control and observation, while the separate cover enables reversible sealing for easy opening and closing during operation.
Data Source
Figure 1A~1B
Figure 2~3
AI summary
The invention relates to a reversible microfluidic chip (10) which comprises a lower portion (30) and an upper portion (20) and which can be quickly and easily opened and closed several times by bringing the upper portion (20) into contact with the lower portion (30) of the chip (10). At least one of the portions (20, 30) of the chip (10) comprises a microfluidic structure (40). The upper portion (20) of the chip (10) comprises at least one layer of a flexible epoxy polymeric material and one layer of a more rigid epoxy polymeric material, one portion of the flexible layer being in direct physical contact with the lower portion (30) of the chip when the microfluidic chip (10) is in a closed configuration.