Reversible UV-Adhesive Bonding for Non-Destructive Biological Sample Access
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Solution Overview
Problem
Conventional fluidic devices in biological applications face challenges in maintaining device integrity across scales and accessing internal samples without damaging the device or sample, as they often rely on permanent adhesives that require destruction for sample analysis, leading to increased costs and compromised sample integrity.
Innovation Solution
The development of reversibly bonded devices using a UV-sensitive adhesive component that allows for strong adhesion during use and reversible separation upon exposure to light, enabling easy deconstruction for sample access without damaging the device or sample.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If permanent adhesive methods are used to adhere device components together, then device structural integrity is improved, but device deconstructability deteriorates
Solution Approach 1:
The adhesive component transitions from a static permanent bond to a dynamic reversible bond that can be switched between bonded and unbonded states through UV light exposure, allowing the device to be both structurally intact during use and easily deconstructed for sample access
Solution Approach 2:
The adhesive component's bonding properties are changed by altering the UV light exposure parameter - when UV light is exposed, the adhesive becomes reversible and allows separation, while without UV exposure, the adhesive maintains strong bonding for structural integrity
2Stability of the object's composition
If permanent adhesive methods are used to couple device components, then device assembly stability is improved, but sample access integrity deteriorates
Solution Approach 1:
The adhesive bond dynamically transitions from stable during use to reversible upon UV exposure, enabling sample access without compromising either assembly stability during operation or sample integrity during analysis
Solution Approach 2:
The UV-sensitive adhesive component acts as an intermediary between the device components and the sample access requirement, mediating between the need for stable assembly and the need for intact sample retrieval
3Ease of manufacture
If conventional construction techniques with gaskets and external hardware are used, then device assembly ease is improved, but device integrity at large scale deteriorates
Solution Approach 1:
The mechanical assembly system using gaskets and external hardware is replaced with a chemical bonding system using UV-sensitive adhesive components that provide both ease of assembly and reliable large-scale integrity through uniform adhesive bonding
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution maintains device and sample integrity, reduces production costs, and facilitates analysis by allowing for non-destructive access to internal samples, while maintaining the structural integrity of the device.
Implementation Method 1
a reversible bonding component... UV-sensitive adhesive component that allows for strong adhesion during use and reversible separation upon exposure to light
Data Source
AI summary
The present disclosure concerns embodiments of reversibly bonded devices that comprise a reversible bonding component. The reversible bonding component is able to exhibit strong adhesive properties so as to couple device components, but upon exposure to an energy source, the strong adhesive properties are weakened. By weakening the adhesive strength of the reversible bonding component, the device can be deconstructed to access internal biological samples for analysis and characterization.