Reworkable Adhesive Composition for Optical Electronics
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Solution Overview
Problem
Current (meth)acrylic based structural adhesives lack reworkability while requiring high bond strength and flexibility, especially in applications like laptop frame and mobile phone back cover bonding, where misattachments need to be avoided and aging performance is crucial.
Innovation Solution
A reworkable adhesive composition comprising a first (meth)acrylic monomer with a glass transition temperature above 130°C, a second monomer between 80°C to 130°C, a third monomer with a temperature between 0°C and 80°C, a polymeric elastomer, and an initiator, which provides good bonding strength at room temperature and excellent reworkability at elevated temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If (meth)acrylic based structural adhesives are used to achieve high bond strength, then bonding performance is improved, but reworkability deteriorates
Solution Approach 1:
The patent applies parameter changes by utilizing temperature-dependent glass transition behavior of (meth)acrylic polymers. The adhesive is formulated with specific glass transition temperatures (Tg) that allow it to be rigid and strong at room temperature, then become soft and reworkable at elevated temperatures (above 60°C). This resolves the contradiction by changing the physical state parameter (Tg) based on temperature conditions.
Solution Approach 2:
The adhesive exhibits dynamic properties that change with temperature. At room temperature, the polymer chains are frozen in a glassy state providing high strength. When heated above 60°C, the material transitions to a rubbery state where chains can move, enabling reworkability. This dynamic behavior resolves the contradiction between strength and reworkability.
2Strength
If (meth)acrylic based structural adhesives are used to achieve good bonding performance, then adhesion strength is improved, but aging performance deteriorates
Solution Approach 1:
The patent specifies precise glass transition temperature ranges for the (meth)acrylic polymer (Tg between -50°C to 150°C, preferably 0°C to 100°C) to optimize both bonding strength and aging resistance. By carefully controlling the Tg parameter, the adhesive maintains flexibility and adhesion strength while resisting degradation during aging tests at elevated temperatures and humidity.
3Strength
If (meth)acrylic based structural adhesives are used to achieve high bond strength, then bonding performance is improved, but flexibility deteriorates
Solution Approach 1:
The patent utilizes the glass transition temperature parameter to achieve a balance between strength and flexibility. The (meth)acrylic polymer with controlled Tg provides a rubbery phase that imparts flexibility and elongation at break, while the crosslinked network maintains bonding strength. This resolves the contradiction by optimizing the Tg parameter.
Solution Approach 2:
The adhesive forms a composite structure combining crosslinked polymer networks (for strength) with rubbery phases or plasticizers (for flexibility). This composite approach allows simultaneous achievement of high bond strength and material flexibility to accommodate substrate expansion and contraction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition achieves strong bonding at room temperature, maintains bonding strength after aging, and allows for easy reworkability above 60°C, making it suitable for industrial production and various substrate applications.
Implementation Method 1
a first (meth)acrylic monomer, having a glass transition temperature higher than 130° C., a second (meth)acrylic monomer, having a glass transition temperature from 80° C. to 130° C., a third (meth)acrylic monomer, having a glass transition temperature greater than or equal to 0° C. and less than 80° C.
Data Source
AI summary
This invention relates to a reworkable adhesive composition for assembling optical electronic devices. In particular, the present invention relates to a reworkable adhesive composition offering, when cured, a good bonding strength at room temperature and an excellent reworkability at elevated temperature.


