Reworkable BGA Socket Interconnects for Replaceable Package Substrates
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional ball grid array (BGA) interconnects in semiconductor packages are difficult to rework and replace, limiting the flexibility of original equipment manufacturers (OEMs) to respond to changing market demands and requiring complex reflow processes, which are not suitable for thin and conformal substrates.
Innovation Solution
The use of reworkable BGA socket connections with embedded stud-bump elements in board substrates, allowing for variable configuration components to be interchanged without altering the existing board substrate design, using enabling loads to mechanically clamp and electrically couple package substrates with BGA interconnects, and incorporating protruding features within sockets to enhance holding force and surface area contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional BGA interconnects are used for attaching semiconductor packages to board substrates, then reliable electrical connections are achieved, but the packages become difficult to rework and replace
Solution Approach 1:
The invention segments the BGA attachment system into two distinct parts: a reusable socket structure embedded in the board substrate and a replaceable package substrate with BGA balls. This segmentation allows the socket to remain permanently mounted on the board while the package substrate can be independently removed and replaced, resolving the contradiction between reliable connection and ease of repair.
Solution Approach 2:
The socket acts as an intermediary component between the board substrate and the package substrate. It provides a reusable interface that maintains reliable electrical connections while enabling easy package replacement. The socket's recesses receive and hold the BGA balls, creating a stable connection point that can accommodate multiple package changes without requiring board rework.
2Strength
If reflow processes are used to attach BGA packages, then strong mechanical and electrical bonds are formed, but the process is complex and unsuitable for thin and conformal substrates
Solution Approach 1:
The invention replaces the thermal-reflow-based mechanical bonding system with a direct mechanical insertion system. Instead of using heat and pressure to reflow solder and create strong bonds, the package substrate with BGA balls is directly inserted into the socket recesses. The holding force is generated mechanically through the interference fit between the BGA balls and socket recesses, eliminating the need for complex reflow processes and making the system suitable for thin substrates.
3Productivity
If fixed configuration packages are manufactured, then production efficiency is high, but flexibility to adjust product SKUs based on market demands is reduced
Solution Approach 1:
The invention introduces dynamic reconfigurability to the manufacturing system by enabling hot-swappable package substrates. While the socket infrastructure can be manufactured once with high efficiency, the package substrates can be dynamically changed to match different market demands. This allows OEMs to quickly adjust product SKUs by replacing package substrates without reworking the board, combining manufacturing efficiency with product flexibility.
Solution Approach 2:
The socket structure serves multiple functions: it provides mechanical support, electrical connection, and package retention for different package types. By designing universal sockets that can accommodate various BGA packages, the system enables flexible product configuration changes while maintaining a standardized, efficiently manufactured board substrate platform.
4Force
If high enabling loads are applied to attach package substrates, then secure mechanical clamping is achieved, but damage to thin substrates may occur
Solution Approach 1:
The invention applies local quality by concentrating the clamping force at specific contact points between the BGA balls and socket recesses, rather than distributing high loads across the entire substrate surface. The recesses are precisely shaped to match the BGA ball geometry, creating localized interference fits that generate sufficient holding force through small contact areas. This localized force application secures the package substrate without subjecting thin substrates to damaging global stress.
Data Source
AI summary
The systems and methods described herein are directed to using a plurality of interface elements (e.g., sockets) and/or stud-bump elements embedded into board substrates (e.g., a motherboard) to enable the interchange of variable configuration components (e.g., electronic components, chips, and the like) that are mounted on package substrates having ball grid arrays (BGAs). In some aspects, this interchange can be accomplished while leaving the pre-existing board substrate design and various peripheral system components of the board substrate unchanged.