Reworkable SiP with Frame Board for Warpage Control
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Solution Overview
Problem
Current system in package (SiP) structures permanently encapsulate components in molding compound materials, making them unavailable for rework and limiting manufacturing yield and assembly efficiency due to permanent attachment and increased z-height.
Innovation Solution
Incorporating reinforcement structures such as a frame board and unbalanced package substrates with top and bottom molding layers, allowing components to remain unmolded and available for rework, using reworkable underfill materials and optimizing package substrate design for reduced z-height and warpage control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If components are permanently encapsulated in molding compound materials, then mechanical protection and structural integrity are improved, but rework capability and manufacturing yield are worsened
Solution Approach 1:
The patent divides the package into distinct segments: a molding compound encapsulating only the die while leaving components exposed, and a separate reinforcement structure (frame board or substrate) providing mechanical support. This segmentation allows components to remain protected yet accessible for rework.
Solution Approach 2:
The patent introduces an intermediary reinforcement structure (frame board or substrate) that mediates between the need for mechanical protection and rework accessibility. This intermediary provides structural integrity without requiring permanent encapsulation of components in molding compound.
2Stability of the object's composition
If components are permanently encapsulated in molding compound materials, then structural integrity is improved, but assembly efficiency and manufacturing yield are worsened
Solution Approach 1:
The package structure is segmented to provide structural integrity through a reinforcement framework rather than through complete encapsulation, enabling faster assembly and rework operations while maintaining package stability.
Solution Approach 2:
The patent changes the structural support parameter from relying on molding compound encapsulation to relying on a separate reinforcement structure (frame board or substrate), which provides equivalent mechanical stability without the drawbacks of permanent encapsulation.
3Stability of the object's composition
If reinforcement structures are added to maintain mechanical robustness, then structural stability is improved, but package height is worsened
Solution Approach 1:
The patent transitions from vertical reinforcement (adding height) to planar reinforcement (frame boards or substrates extending in the x-y plane). This dimensional change provides structural stability without increasing package height, as the reinforcement occurs in the lateral plane rather than the vertical dimension.
Solution Approach 2:
The reinforcement structures (frame boards or substrates) are positioned asymmetrically within the package architecture, providing mechanical support at specific locations rather than uniformly throughout, which optimizes structural stability while minimizing overall package height.
Data Source
AI summary
Electronic package structures and assembly methods are described. In an embodiment, an electronic package includes a die mounted face up on a bottom side of a package substrate, and a plurality of components on a top side of the package substrate. The plurality of components may be unmolded, and available for rework. Additional structures are included within the package substrate to provide mechanical rigidity and robustness to the package for warpage control.