3D Inductor Assembly in RF Power Amplifiers to Cut Coupling Loss
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Solution Overview
Problem
Conventional radio frequency power amplifier devices experience significant electromagnetic coupling and efficiency loss due to parallel lead wires causing mutual inductance effects, leading to increased equivalent resistance and reduced power amplifier efficiency.
Innovation Solution
The device incorporates an inductor assembly with a 3D inductor structure, disposed between the active device and grounded capacitor device, utilizing a conductive wire interleaved through holes in the inductor base to minimize electromagnetic coupling and replace equivalent inductance formed by parallel lead wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If parallel lead wires are used to connect the active device and grounded capacitor device, then the device structure is simple, but electromagnetic coupling occurs causing increased equivalent resistance and reduced power amplifier efficiency
Solution Approach 1:
The patent transitions from a planar two-dimensional layout to a three-dimensional stacked architecture. The inductor assembly is positioned vertically above the grounded capacitor device, utilizing the Z-axis dimension to separate components that were previously arranged horizontally. This spatial reconfiguration eliminates parallel lead wire paths and their associated mutual inductance effects, resolving the contradiction between structural simplicity and energy efficiency.
Solution Approach 2:
The inductor assembly serves as an intermediary component between the active device and grounded capacitor device. Rather than directly connecting these components with parallel lead wires, the inductor assembly mediates the electrical connection through its internal winding structure, which inherently provides the necessary inductance while minimizing electromagnetic coupling with other components.
2Ease of manufacture
If parallel lead wires are used for connection, then manufacturing process is simple, but mutual inductance effects cause significant signal loss
Solution Approach 1:
The patent employs three-dimensional stacking to reposition the inductor assembly vertically above the grounded capacitor device. This dimensional change transforms the manufacturing challenge from routing complex non-parallel wires in two dimensions to placing standardized components in stacked layers, which can be achieved through automated pick-and-place machines and reflow soldering processes.
Solution Approach 2:
The patent segments the power amplifier circuit into distinct functional modules: the active device, the inductor assembly, and the grounded capacitor device. Each module is independently packaged and then interconnected through standardized lead wires, allowing for modular manufacturing and assembly while minimizing electromagnetic interference between segments.
3Device complexity
If conventional lead wire arrangement is used, then device structure is simple, but equivalent resistance increases due to electromagnetic coupling
Solution Approach 1:
The patent utilizes vertical stacking in the third dimension to position the inductor assembly above the grounded capacitor device. This spatial separation in the Z-axis direction eliminates the parallel proximity that causes mutual inductance and equivalent resistance increases, while maintaining a relatively simple overall device footprint.
Solution Approach 2:
The patent employs asymmetric spatial arrangement where the inductor assembly is positioned offset from the direct vertical alignment with the active device. This asymmetric configuration optimizes the current paths and minimizes loop areas, thereby reducing electromagnetic coupling and equivalent resistance without requiring symmetric complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces signal loss and enhances power amplifier efficiency by up to 2% while maintaining gain, by eliminating mutual inductance effects and reducing equivalent resistance.
Implementation Method 1
the inductor assembly comprises: an inductor base and a conductive wire; the inductor base is provided with a plurality of through holes penetrating the thickness of the inductor base, and the conductive wire interleavedly passes through the plurality of through holes on two sides of the inductor base from side to side by turns, to form an inductor with a certain three-dimensional space
Implementation Method 2
the third lead wire 13 and the fourth lead wire 14 have the same lead out direction, and have parallel components in the X-axis and the Z-axis, so that the inductances formed by the third lead wire 13 and the fourth lead wire 14 have mutual inductance effects, causing a strong electromagnetic coupling
Data Source
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AI summary
A radio frequency power amplifier device includes an active device, a grounded capacitor device, and an inductor assembly disposed on the grounded capacitor device. The inductor assembly is connected between the active device and the grounded capacitor device. The radio frequency power amplifier device and manufacturing method thereof of the embodiment of the present disclosure connect the inductor assembly between the active device and the grounded capacitor device, which is capable of improving the electromagnetic coupling problem due to the two bonding wires existing the parallel components in the conventional solution, so as to reduce the loss of the output signals, and improve the power amplifier efficiency.