RF Power Amplifier Layout Using Opposite-Side Board Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The size of radio frequency modules increases when transmission power amplifiers include cascaded amplifying elements, making it difficult to miniaturize while maintaining favorable amplification characteristics and reducing signal transmission loss and interference.
Innovation Solution
A radio frequency module with a transmission power amplifier that includes cascaded amplifying elements, where the amplifying elements are mounted on opposite sides of a module board, allowing for adjacent placement and reduced interference, thereby miniaturizing the module while maintaining effective amplification.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If cascaded amplifying elements are included in the transmission power amplifier to increase output power, then the amplification capability is improved, but the size of the radio frequency module increases
Solution Approach 1:
The patent applies three-dimensional stacking by mounting amplifying elements on both the first and second principal surfaces of the module board. This vertical arrangement utilizes the Z-dimension (thickness direction) to place components that would traditionally be arranged horizontally, thereby reducing the footprint area while maintaining the cascaded amplification structure for high output power.
Solution Approach 2:
The patent implements a nested configuration where amplifying elements are stacked vertically on opposite surfaces of the module board. The first amplifying element on the first principal surface and the second amplifying element on the second principal surface are positioned to overlap when viewed from the thickness direction, creating a compact nested structure that reduces overall module size while preserving the cascaded amplification path.
2Area of stationary object
If amplifying elements are placed adjacent to each other to reduce size, then the module footprint is reduced, but signal transmission loss and interference increase
Solution Approach 1:
By transitioning from a two-dimensional planar arrangement to a three-dimensional stacked arrangement, the patent reduces the horizontal footprint area while maintaining adequate spacing between amplifying elements. The vertical separation on opposite board surfaces prevents signal interference that would occur with close horizontal placement, thus reducing transmission loss.
Solution Approach 2:
The module board itself acts as an intermediary structure that separates the first and second amplifying elements on opposite surfaces. This intermediate substrate provides electrical isolation and mechanical support, allowing the amplifying elements to be positioned closely in the horizontal plane without causing signal interference, thereby reducing both footprint area and transmission loss.
Data Source
AI summary
A radio frequency module includes: a transmission power amplifier that includes a plurality of amplifying elements that are cascaded; and a module board on which the transmission power amplifier is mounted, the module board including a first principal surface and a second principal surface on opposite sides of the module board. The plurality of amplifying elements include: a first amplifying element mounted on the first principal surface; and a second amplifying element mounted on the second principal surface and disposed upstream on a signal path from the first amplifying element.