RF Power Amplifier Module with Integrated Cooling Channels
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Solution Overview
Problem
Current high-power RF amplifier modules for microelectronic workpieces are bulky and heavy, making them difficult to integrate into plasma processing systems due to size and weight constraints, while also requiring external cooling and additional shielding components.
Innovation Solution
The design incorporates a compact power amplifier module with integrated cooling channels in the cooling plate and a ground plane, allowing for direct fluid cooling and reduced weight, along with a multi-stage system that includes a pre-amplifier and combiner, all housed in a volume less than 50 cubic inches and weighing less than three pounds, with fins for enhanced heat dissipation and internal RF shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If traditional RF amplifier modules are used to generate high-power RF energy, then the required power output is achieved, but the size and weight become difficult to manage
Solution Approach 1:
The patent combines multiple functions into a single integrated module: the RF amplifier circuit, cooling system (with cooling plate and channels), and housing are merged into one compact unit. This eliminates the need for separate external cooling devices and reduces overall weight while maintaining high power output capability
Solution Approach 2:
The housing serves multiple functions simultaneously: it provides structural support, acts as a thermal management component with integrated cooling channels, and serves as a mounting structure for RF components. This multi-functionality reduces the number of separate components needed, thereby reducing weight
2Power
If traditional RF amplifier modules are used to generate high-power RF energy, then the required power output is achieved, but the volume occupied becomes excessive
Solution Approach 1:
The patent implements a nested structure where RF components are mounted on circuit boards that are positioned within the housing, the cooling plate is integrated into the housing structure, and cooling channels are embedded within the housing walls. This nesting approach maximizes space utilization and minimizes overall volume
Solution Approach 2:
The patent utilizes three-dimensional space efficiently by positioning cooling channels within the housing walls and using vertical stacking of circuit boards and components. This dimensional optimization allows high power output in a compact volume by exploiting spatial arrangement rather than simply scaling up linear dimensions
3Temperature
If external cooling systems are used for RF amplifier components, then heat dissipation is achieved, but the device complexity increases
Solution Approach 1:
The cooling system is merged with the housing structure itself. The housing contains internal cooling channels that are formed as integral parts of the housing, eliminating the need for separate external cooling devices, pipes, and mounting hardware. This integration simplifies the overall device while maintaining effective heat dissipation
Solution Approach 2:
The housing structure serves its own cooling needs by incorporating cooling channels within itself. The housing is not just a protective enclosure but actively participates in thermal management by conducting heat away from RF components through its integrated cooling system, reducing the need for additional dedicated cooling components
4Object-affected harmful factors
If additional RF shielding components are used, then electromagnetic interference protection is improved, but the weight and volume increase
Solution Approach 1:
The housing is designed to serve as both a structural support and an RF shielding component. By using conductive materials for the housing and incorporating grounding features, the same structure that provides mechanical support also provides electromagnetic shielding, eliminating the need for separate shielding materials and reducing weight
Solution Approach 2:
The RF shielding function is merged with the housing structure. Instead of adding separate shielding layers or enclosures, the housing itself is designed with shielding capabilities through material selection and grounding arrangements, combining structural and electromagnetic protection functions in one element
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient heat dissipation and reduced size and weight, allowing for higher power levels (up to 300 watts) across various frequency bands without the need for external cooling or additional shielding, improving the integration of RF amplifiers in plasma processing systems.
Implementation Method 1
cooling channels configured to receive a cooling fluid, where the one or more cooling channels are open to a top surface of the cooling plate and are positioned to dissipate heat from one or more of the RF circuit components through the ground plane
Implementation Method 2
cooling channels configured to receive a cooling fluid... positioned to dissipate heat
Implementation Method 3
one or more fins positioned within the one or more cooling channels to facilitate heat dissipation
Implementation Method 4
fins positioned within the one or more cooling channels to facilitate heat dissipation
Data Source
AI summary
Embodiments are described for modules, multi-stage systems, and related methods for radio frequency (RF) power amplifiers with reduced size and weight requirements. Fluid cooling is incorporated directly into the power amplifier (PA) module design rather than requiring PA modules to be mounted on separate cooling devices. For one embodiment, a PA module includes a circuit board, RF circuit components, a ground plane, and a cooling plate having one or more cooling channels to receive a cooling fluid. The cooling channels are positioned to dissipate heat from the RF circuit components through the ground plane. For a further embodiment, the PA module also includes RF bias and power electronics within a housing for the PA module without requiring an external control board or power conversion electronics. Also disclosed are multi-stage PA systems having a plurality of PA modules that are similarly cooled using cooling channels.