RF Power Amplifier Module Coupler Layout for Low-Loss Combining
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Solution Overview
Problem
Existing semiconductor amplifiers face limitations in power per unit module and high combining loss when multiple combiners are used, with existing combiners having a limited number of combinable input ports and high loss coefficients.
Innovation Solution
A radio frequency power amplifier module with a module-type design that includes a coupler extending from the module body for easy assembly and maintenance, featuring a shielded module main body with a coupler for electromagnetic wave transmission and a flange for secure attachment, allowing for easy installation and removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple existing combiners are combined in a multi-stage to overcome the limitation of the number of combinable input ports, then the number of combinable input ports is increased, but the final combining loss rapidly increases
Solution Approach 1:
The patent divides the combiner into multiple independent module-type combiners, each handling a subset of input ports. This segmentation allows each individual combiner to operate with optimized coupling coefficients, minimizing loss at each stage rather than accumulating loss across a single multi-stage structure.
Solution Approach 2:
The patent optimizes the coupling coefficient of each individual combiner module to minimize combining loss. By adjusting this parameter for each module rather than applying a uniform coefficient across all stages, the system achieves lower overall combining loss while supporting more input ports.
2Adaptability or versatility
If a waveguide cavity combiner is used to increase the number of input ports in the high frequency, then the number of input ports is significantly increased, but the complexity of installing and maintaining a large number of amplifiers increases
Solution Approach 1:
The system is divided into multiple identical module-type combiners, each handling a specific subset of input ports. This modular architecture simplifies installation and maintenance by allowing individual modules to be independently handled, tested, and replaced without affecting the entire system.
Solution Approach 2:
Each module-type combiner is designed with universal characteristics, allowing them to perform the same function for different subsets of input ports. This universality simplifies the overall system design and makes installation and maintenance more straightforward, as the same module design can be replicated across multiple positions.
3Power
If existing combiners are used for semiconductor amplifiers, then the amplifiers can be combined to achieve higher power, but the loss coefficient at each combining stage increases the final combining loss
Solution Approach 1:
The patent optimizes the coupling coefficient parameter for each individual combiner module to minimize combining loss. By carefully selecting and adjusting this parameter, the system achieves efficient power combining while maintaining low loss at each stage, thereby reducing the final combining loss even as output power increases.
Solution Approach 2:
By segmenting the power combining into multiple independent modules, each operating with optimized parameters, the system avoids the cumulative loss problem of multi-stage existing combiners. Each module processes a subset of amplifiers with optimized coupling, reducing overall loss while achieving the desired high output power.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates easy installation, maintenance, and reduces combining loss by enabling individual performance verification and calibration, addressing phase and amplitude imbalances, and ensuring high combining efficiency.
Implementation Method 1
a coupler configured to electrically connect to the amplifier semiconductor, and protrude and extend to the outside of the module main body to transmit a radio frequency
Implementation Method 2
wherein on the front side of the module main body, an assembly slot is provided so that the coupler extends from the inside to the outside of the module main body
Data Source
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AI summary
Disclosed is a radio frequency power amplifier module. The radio frequency power amplifier module according to an embodiment of the present invention includes a module main body one or more amplifier semiconductor installed inside the module main body, and a coupler electrically connected to the amplifier semiconductor and protruding and extending to the outside of the module main body to transmit electromagnetic waves.