RF Power Amplifier Module Assembly with Heat-Dissipation Substrate
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Solution Overview
Problem
The high cost and complexity of assembling RF power amplifier modules, particularly due to the expensive packaging structure and carrier flange, which accounts for 80% of the device's price, and the need for improved heat dissipation in RF modules.
Innovation Solution
The RF power amplifier module design includes a power device with affiliated electronic components connected through lead wires, a power circuit board, a heat-dissipation substrate, and an auxiliary circuit board, with protective covers forming cavities for electromagnetic shielding and a thermally conductive packing material between the heat-dissipation substrate and housing for enhanced heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a package structure with input/output pins is used, then electrical connection between PCB and power device is enabled, but packaging cost increases to 80% of the whole device price
Solution Approach 1:
The patent extracts and eliminates the expensive package structure and carrier flange from the traditional RF power amplifier design. By directly mounting the power device die onto the PCB with solder bumps, it removes the intermediate packaging layers (ceramic package, input/output pins, carrier flange) that constitute 80% of the device cost, while maintaining electrical connection functionality through lead wires and soldering techniques.
2Ease of manufacture
If package structure and carrier flange are removed to reduce cost, then manufacturing cost decreases, but assembly complexity increases
Solution Approach 1:
The patent merges multiple separate components and assembly steps into a simplified integrated structure. The power device die is directly mounted on the PCB, lead wires directly connect the die to the PCB trace, and the housing directly encloses the assembly without requiring separate package structures or carrier flanges. This consolidation reduces the number of parts and assembly operations while maintaining all necessary electrical and mechanical functions.
3Object-affected harmful factors
If traditional packaging structure is used, then component protection is provided, but heat dissipation performance deteriorates
Solution Approach 1:
The patent introduces a thermally conductive adhesive as an intermediary material between the power device die and the PCB. This adhesive serves dual functions: it provides mechanical bonding to hold the die in place (replacing the mechanical support function of the package structure) and simultaneously conducts heat away from the die to the PCB and heat sink, thereby improving heat dissipation performance while maintaining component protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces assembly complexity and cost, improves heat dissipation, and allows for a more efficient and cost-effective manufacturing process while maintaining high heat-dissipation performance.
Implementation Method 1
a thermally conductive packing material disposed between the heat-dissipation substrate and a housing or an extending structure of the housing
Implementation Method 2
a power device including a power device die and affiliated electronic components that are connected to each other through lead wires
Data Source
AI summary
The present disclosure relates to a radio frequency (RF) unit of a base station, and more particularly, to a method of manufacturing an RF power amplifier module, an RF power amplifier module, an RF module, and a base station. The RF power amplifier module includes at least a power device, a power circuit board, a heat-dissipation substrate, and input/output ports. A power device die of the power device and the power circuit board are mounted on the heat-dissipation substrate. The power device die is connected to the power circuit board through packaging lead wires. In one exemplary embodiment, a heat-dissipation effect and manufacturing efficiency of the RF power amplifier module are improved and a cost of the RF power amplifier module is reduced.