RF Power Amplifier Layout With Opposite-Side Transformer Isolation
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Solution Overview
Problem
The existing difference amplifying type power amplifier in radio frequency modules is bulky due to the large number of circuit elements, leading to increased size and transfer loss of radio frequency signals.
Innovation Solution
A radio frequency module with a power amplifier configuration where the first and second amplifying circuit elements and the output transformer are disposed on opposite sides of a module board, reducing coupling between circuit components and minimizing transfer loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a difference amplifying type power amplifier with many circuit elements is used, then power gain can be improved, but the size of the radio frequency module increases
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional stacked configuration, placing the first amplifying circuit element on one surface of the module board and the second amplifying circuit element on the opposite surface. This vertical stacking reduces the horizontal footprint and overall module size while maintaining the difference amplifying topology and its associated power gain benefits
Solution Approach 2:
The patent divides the power amplifier into spatially separated segments (first and second amplifying circuit elements on opposite surfaces) connected by conductive structures. This segmentation allows each element to be optimized independently while reducing mutual interference and overall module footprint, resolving the contradiction between maintaining power gain and reducing size
2Volume of moving object
If circuit elements are disposed close together to reduce module size, then the size is reduced, but transfer loss of radio frequency signals increases
Solution Approach 1:
The patent introduces conductive structures (via holes, conductive lines, or bonding wires) as intermediaries to connect the amplifying circuit elements on opposite surfaces. These intermediaries provide controlled impedance paths that minimize signal degradation, allowing close spacing for size reduction while maintaining low transfer loss through proper electromagnetic coupling design
Solution Approach 2:
The patent applies different structural characteristics to different regions: the amplifying circuit elements are positioned close to the module board surfaces for miniaturization, while the connecting conductive structures are designed with specific impedance characteristics and shielding to minimize transfer loss in the critical signal path regions
3Ease of manufacture
If circuit elements are disposed on the same surface to simplify layout, then manufacturing is simplified, but isolation between transmission and reception circuits decreases
Solution Approach 1:
By moving from a single-surface two-dimensional layout to a dual-surface three-dimensional configuration, the patent achieves natural spatial separation between transmission and reception circuits. This vertical separation provides inherent isolation against spurious waves and electromagnetic interference while maintaining manufacturing feasibility through standardized multi-surface PCB or module board fabrication processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration results in a smaller radio frequency module with reduced transfer loss and improved isolation between transmission and reception circuits, enhancing reception sensitivity and reducing spurious waves.
Implementation Method 1
an output transformer that includes a first coil and a second coil. An end of the first coil is connected to an output terminal of the first amplifying circuit element, and another end of the first coil is connected to an output terminal of the second amplifying circuit element
Data Source
AI summary
A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier; and a first circuit component. The power amplifier includes: a first amplifying circuit element; a second amplifying circuit element; and an output transformer that includes a primary coil and a secondary coil. An end of the primary coil is connected to an output terminal of the first amplifying circuit element. Another end of the primary coil is connected to an output terminal of the second amplifying circuit element. An end of the secondary coil is connected to an output terminal of the power amplifier. The first amplifying circuit element and the second amplifying circuit element are disposed on the first principal surface. The first circuit component is disposed on the second principal surface.