RF Power Amplifier Output Circuit for Wideband PCB Reduction

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Solution Overview

Problem

Radio frequency power amplifiers require high-cost substrates and large-area printed circuit boards to achieve good bandwidth characteristics, hindering miniaturization efforts.

Innovation Solution

The use of output circuits with electrical lengths of 50 to 90 degrees and 120 to 180 degrees formed by capacitors and inductors in the first and second amplifying branches, respectively, reduces the need for high-cost substrates and large-area printed circuit boards by leveraging the integration capabilities of inductors and capacitors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If transmission line structure is used to achieve good bandwidth characteristics, then bandwidth performance is improved, but substrate cost and PCB area increase

Engineering Contradiction:
Improvebandwidth characteristicsVSAvoidPCB area
Core Design Contradiction:
Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent changes the electrical length parameters of the transmission lines from conventional values (90 degrees and 180 degrees) to specific ranges (50-90 degrees for first transmission line, 120-180 degrees for second transmission line). This parameter optimization allows achieving good bandwidth characteristics with reduced transmission line lengths, thereby reducing PCB area while maintaining wideband performance

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent divides the power amplifier into two separate amplifying branches with different transmission line electrical lengths. The first amplifying branch uses a transmission line with 50-90 degrees electrical length, and the second amplifying branch uses a transmission line with 120-180 degrees electrical length. This segmentation allows each branch to be optimized independently, achieving wideband characteristics through their combined operation while minimizing total PCB area

Inventive Principle:
Principle #1Segmentation

2Adaptability or versatility

If transmission line structure is used to achieve good bandwidth characteristics, then bandwidth performance is improved, but substrate cost increases

Engineering Contradiction:
Improvebandwidth characteristicsVSAvoidsubstrate cost
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

By optimizing the electrical length parameters to specific ranges rather than fixed conventional values, the patent reduces the required transmission line lengths. This parameter optimization decreases the complexity and cost of substrate fabrication while maintaining the wideband performance required for modern communication systems

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS20250219597A1Radio frequency power amplifier and wireless signal transmitting system
Publication Date: 2025.07.03 SUZHOU WATECH ELECTRONICS CO LTD
  • US20250219597A1 patent drawing
  • US20250219597A1 patent drawing
  • US20250219597A1 patent drawing

AI summary

Disclosed are a radio frequency power amplifier and a wireless signal transmitting system. The radio frequency power amplifier includes a first amplifying branch, comprising a first transistor and a first output circuit; and a second amplifying branch, comprising a second transistor and a second output circuit. The first output circuit comprises a line with an electrical length of 50 degrees to 90 degrees formed based on capacitors and inductors, and the second output circuit comprises a line with an electrical length of 120 degrees to 180 degrees formed based on capacitors and inductors.