Lightweight RF Antenna Structures Using Adhesive Bonded Flex Substrates

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Next-generation large area multifunction active arrays for space and airborne antennas require lighter weight, lower cost, and more conformal designs, which existing technologies struggle to achieve while maintaining performance in radar and communication systems.

Innovation Solution

The use of lightweight materials and innovative processes such as 3-D circuitry on folded/formed RF flex layers, integrating electrical and mechanical functions, and applying adhesives to form spacers for precise bonding of flexible circuit substrates, reducing weight and number of layers by up to 75%.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Weight of moving object

If lightweight materials are used to form antenna component structures, then weight is reduced, but assembly difficulty increases

Engineering Contradiction:

Improveantenna structure weightVSAvoidassembly difficulty

Core Design Contradiction:

Weight of moving objectVSEase of manufacture

Solution Approach 1:

Adhesive is applied to substrates before assembly to create pre-bonded units with integrated RF feeds and radiating elements. This preliminary bonding action simplifies subsequent assembly steps and ensures proper alignment of lightweight components that would be difficult to assemble otherwise

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

Adhesive serves as an intermediary material that bonds lightweight substrate components together, enabling assembly of antenna structures that would be difficult to join using traditional mechanical fastening methods. The adhesive mediates between the lightweight substrates to create strong, integrated assemblies

Inventive Principle:

Principle #24Intermediary (Mediator)

2Adaptability or versatility

If multiple layers are used to achieve conformal antenna structures, then performance is improved, but weight and complexity increase

Engineering Contradiction:

Improveconformal structure capabilityVSAvoidantenna structure weight

Core Design Contradiction:

Adaptability or versatilityVSWeight of moving object

Solution Approach 1:

The patent uses flexible circuit substrates that can be formed into three-dimensional conformal shapes. These thin, flexible films allow the antenna to conform to curved surfaces and complex geometries without requiring multiple rigid layers, thereby maintaining adaptability while reducing weight

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent transitions from traditional planar multi-layer PCB structures to three-dimensionally formed flexible substrates. By utilizing the third dimension and forming substrates into curved and folded configurations, the antenna achieves conformal capability without proportionally increasing weight or complexity

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Strength

If traditional assembly methods are used, then structural integrity is maintained, but weight reduction opportunities are lost

Engineering Contradiction:

Improvestructural integrityVSAvoidantenna structure weight

Core Design Contradiction:

StrengthVSWeight of moving object

Solution Approach 1:

The patent replaces traditional mechanical fastening systems (screws, rivets, clips) with adhesive bonding. This substitution eliminates the need for heavy mechanical fasteners while maintaining structural integrity through chemical bonding, thereby enabling weight reduction without sacrificing strength

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the bonding mechanism from mechanical to chemical adhesion. By altering the fundamental parameter of how components are joined, the system achieves both structural integrity and weight reduction, as adhesive bonding provides sufficient strength while adding minimal weight compared to mechanical fasteners

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in a lightweight, rigid, and high-performance RF antenna structure that meets the weight requirements for airship and space platforms, enhancing RF signal routing and power distribution without increasing panel area or number of vias and traces.

Implementation Method 1

applying an adhesive to a plurality of locations on a surface of the flat substrate or the formed substrate, joining the flat substrate and the formed substrate using the adhesive

Methodology Applied

Scientific EffectAdhesive bonding: Adhesive

Implementation Method 2

heating the joined flat substrate and the formed substrate to bond the substrates

Methodology Applied

Scientific EffectThermal heating: Heating

Implementation Method 3

heating the surface of the first feed assembly, wherein the heated first adhesive forms a plurality of spacers

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS8043464B2Systems and methods for assembling lightweight RF antenna structures

Publication Date: 2011.10.25 RAYTHEON CO

AI summary

Systems and methods for assembling lightweight RF antenna structures are provided. In one embodiment, the invention relates to a process for forming a lightweight antenna including a process for forming a first feed assembly for the antenna, the process for forming the first feed assembly including providing a flat flexible circuit substrate, providing a formed flexible circuit substrate, applying an adhesive to a plurality of locations on a surface of the flat substrate or the formed substrate, joining the flat substrate and the formed substrate using the adhesive, and heating the joined flat substrate and the formed substrate to bond the substrates.