RF Antenna Interposer With High-Dielectric Encapsulation

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Solution Overview

Problem

Integrated RF antennas in semiconductor packages suffer from poor RF transmission and reception performance due to increased substrate layers, which also raise manufacturing costs, lead time, and introduce defects, affecting yield and reliability.

Innovation Solution

A semiconductor package with an RF antenna interposer having a high dielectric constant encapsulation is developed, featuring a reduced number of conductive layers and a high dielectric constant encapsulant, which improves RF performance and reduces manufacturing complexity by minimizing warpage and defects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the number of substrate layers is increased for multi-function integration and signal stability, then the RF transmission and reception performance deteriorates, but the manufacturing cost and lead time increase, and warpage and defects are introduced

Engineering Contradiction:

ImproveRF transmission and reception performanceVSAvoidnumber of substrate layers

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the RF antenna structure with the interposer substrate by embedding the antenna within the interposer layers rather than using separate substrate layers. This integration achieves multi-functionality (antenna and interconnection) in a single structure, reducing the total number of substrate layers while maintaining RF performance and signal stability.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The interposer substrate serves multiple functions simultaneously: it provides mechanical support, electrical interconnection, and hosts the RF antenna structure. This multi-functionality eliminates the need for additional dedicated substrate layers for antenna integration, thereby reducing overall device complexity while improving reliability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

Engineering Contradiction:

Improvesignal stabilityVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

By combining the antenna structure with the interposer substrate in a single integrated design, the patent reduces the total number of layers that need to be manufactured and assembled. This simplification directly reduces manufacturing cost while maintaining signal stability through the integrated structure.

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If the number of substrate layers is increased for multi-function integration, then the RF transmission and reception performance deteriorates, but the lead time increases

Engineering Contradiction:

ImproveRF transmission and reception performanceVSAvoidlead time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The integration of the RF antenna within the interposer substrate allows for concurrent processing of antenna formation and interconnection layer creation. This merging of processes reduces the sequential manufacturing steps and associated lead time while maintaining RF performance.

Inventive Principle:

Principle #5Merging (Combining)

4Device complexity

If the number of substrate layers is increased, then warpage and defects are introduced, but the manufacturing yield and reliability decrease

Engineering Contradiction:

Improvenumber of substrate layersVSAvoidmanufacturing yield

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

By merging the antenna structure with the interposer substrate, the patent reduces the total number of interface layers and bonding steps. This reduction minimizes potential sources of warpage and defects, thereby improving manufacturing yield and overall reliability.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances RF transmission and reception quality while reducing manufacturing costs and lead time, improving yield and reliability by using a high dielectric constant encapsulant with discrete RF antenna interposers, allowing for more efficient integration of RF functions in semiconductor packages.

Implementation Method 1

a high dielectric constant encapsulation

Methodology Applied

Scientific EffectDielectric constant: Dielectric Permittivity

Data Source

PatentUS11894314B2Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulation

Publication Date: 2024.02.06 STATS CHIPPAC MANAGEMENT PTE LTD

AI summary

A semiconductor device has a substrate and an electrical component disposed over a surface of the substrate. An antenna interposer is disposed over the substrate. A first encapsulant is deposited around the antenna interposer. The first encapsulant has a high dielectric constant. The antenna interposer has a conductive layer operating as an antenna and an insulating layer having a low dielectric constant less than the high dielectric constant of the first encapsulant. The antenna interposer is made from an antenna substrate having a plurality of antenna interposers. Bumps are formed over the antenna substrate and the antenna substrate is singulated to make the plurality of antenna interposers. A second encapsulant is deposited over the electrical component. The second encapsulant has a low dielectric constant less than the high dielectric constant of the first encapsulant. A shielding layer is disposed over the second encapsulant.