RF Antenna Interposer With High-Dielectric Encapsulation

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Solution Overview

Problem

Existing semiconductor devices with integrated RF antennas suffer from poor RF transmission and reception performance due to the increased number of substrate layers, which raises manufacturing costs, lead times, and introduces defects such as warpage and lower yield.

Innovation Solution

The implementation of an RF antenna interposer substrate with a high dielectric constant encapsulation, which reduces the number of conductive layers and uses a high dielectric constant encapsulant to enhance RF performance while minimizing manufacturing complexities.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the number of substrate layers is increased for multi-function integration and signal stability, then signal in/out stability is improved, but manufacturing cost increases and lead time increases

Engineering Contradiction:

Improvesignal in/out stabilityVSAvoidnumber of substrate layers

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines multiple substrate layers into a single integrated RF antenna interposer substrate that provides both signal routing and antenna functionality. This merging approach maintains signal stability while reducing the total number of separate substrate layers, thereby lowering manufacturing complexity and cost.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The RF antenna interposer substrate serves multiple functions simultaneously: it acts as a signal routing substrate, an antenna element, and an RF shielding structure. This multi-functionality eliminates the need for separate dedicated antenna substrates and signal layers, reducing overall device complexity while maintaining signal integrity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If the number of substrate layers is increased for multi-function integration, then signal in/out stability is improved, but lead time increases

Engineering Contradiction:

Improvesignal in/out stabilityVSAvoidlead time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

By merging signal routing and antenna functions into a single interposer substrate, the patent reduces the number of assembly steps and manufacturing processes required, thereby shortening lead time while maintaining signal stability.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The RF antenna interposer substrate is pre-fabricated with integrated signal routing paths and antenna elements before final assembly. This preliminary integration of multiple functions into a single component reduces on-site assembly time and manufacturing lead time.

Inventive Principle:

Principle #10Preliminary action

3Adaptability or versatility

If the number of substrate layers is increased, then multi-function integration is improved, but warpage is introduced

Engineering Contradiction:

Improvemulti-function integrationVSAvoidwarpage

Core Design Contradiction:

Adaptability or versatilityVSStability of the object's composition

Solution Approach 1:

The patent merges multiple functions into a single RF antenna interposer substrate with controlled thickness, eliminating the cumulative warpage effects that would result from stacking multiple separate substrate layers. The unified structure provides better dimensional stability while maintaining multi-functionality.

Inventive Principle:

Principle #5Merging (Combining)

4Adaptability or versatility

If the number of substrate layers is increased, then multi-function integration is improved, but defects increase and yield decreases

Engineering Contradiction:

Improvemulti-function integrationVSAvoidyield

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

By integrating multiple functions into a single RF antenna interposer substrate, the patent reduces the total number of interfaces and bonding steps required, thereby minimizing defect generation and improving manufacturing yield while maintaining multi-functionality.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution improves RF transmission and reception quality, reduces manufacturing costs and lead times, and enhances the reliability and yield of semiconductor packages by managing warpage and defects.

Implementation Method 1

an RF antenna interposer substrate with a high dielectric constant encapsulation

Methodology Applied

Scientific EffectDielectric constant: Dielectric Permittivity

Data Source

PatentUS12211803B2Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulation

Publication Date: 2025.01.28 STATS CHIPPAC MANAGEMENT PTE LTD

AI summary

A semiconductor device has a substrate and an electrical component disposed over a surface of the substrate. An antenna interposer is disposed over the substrate. A first encapsulant is deposited around the antenna interposer. The first encapsulant has a high dielectric constant. The antenna interposer has a conductive layer operating as an antenna and an insulating layer having a low dielectric constant less than the high dielectric constant of the first encapsulant. The antenna interposer is made from an antenna substrate having a plurality of antenna interposers. Bumps are formed over the antenna substrate and the antenna substrate is singulated to make the plurality of antenna interposers. A second encapsulant is deposited over the electrical component. The second encapsulant has a low dielectric constant less than the high dielectric constant of the first encapsulant. A shielding layer is disposed over the second encapsulant.