RF Antenna Module Laminate Structure Thermal Management
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Solution Overview
Problem
Conventional microwave antenna modules are costly due to the use of expensive ceramic materials and have long manufacturing lead times, which is not suitable for compact three-dimensional assemblies where radiating elements need to be closely spaced.
Innovation Solution
A laminate structure is created by laminating conductive and dielectric layers with ground plane metal layers, interconnect vias, and plated cutouts to form a low-cost RF antenna module, incorporating a heat sink base plate and standoffs for thermal management, and wirebonding ASICs and MMICs for efficient signal distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional ceramic materials (Alumina, Ferro A6, Dupont 943) are used for microwave modules, then manufacturing precision and reliability are improved, but cost increases and manufacturing lead time extends
Solution Approach 1:
The patent changes the material parameter from conventional ceramic (Alumina, Ferro A6, Dupont 943) to low-cost laminate material, achieving cost reduction while maintaining manufacturing precision through controlled lamination processes and standardized via hole fabrication
Solution Approach 2:
The patent replaces expensive ceramic materials with inexpensive laminate materials that can be rapidly manufactured, accepting the trade-off of using shorter-lived, lower-cost materials to achieve cost-effective production
2Reliability
If radiating elements are closely spaced to meet scanning requirements, then antenna beam performance is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent transitions from planar PCB layouts to three-dimensional laminate structures with multiple stacked layers, allowing radiating elements to be closely spaced in the XY plane while utilizing the Z dimension for vertical interconnection via via holes, thereby reducing overall device footprint and complexity
3Volume of moving object
If electronic components are aligned in Z plane to fit available space, then compact three-dimensional assembly is achieved, but manufacturing precision requirements increase
Solution Approach 1:
The patent segments the assembly into multiple discrete laminate layers, each fabricated with standard precision, and uses via holes as precise alignment features to stack layers in the Z direction, achieving compact three-dimensional assembly without requiring excessive overall manufacturing precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the rapid and cost-effective production of high-performance RF antenna modules without the need for ceramic packaging, allowing for compact and efficient microwave signal processing.
Implementation Method 1
a base plate laminated to the first side of the laminate structure; wherein the baseplate operates as a heat sink
Implementation Method 2
creating a plurality of vias within the laminate structure to interconnect the plurality of conductive layers and dielectric layers
Data Source
Figure 1A
Figure 1B
Figure 2
AI summary
Method and structure for a microwave antenna module is provided. The method includes, creating a laminate structure by laminating a plurality of conductive layers and dielectric layers; creating a plurality of layers within the laminate structure to interconnect the plurality of conductive layers and dielectric layers; laminating a base plate to a bottom of the laminate structure; wherein the baseplate operates as a heat sink; and laminating a seal ring to a top periphery of the laminate structure.