RF Module Board Layout for Multiband Amplifier Isolation
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Solution Overview
Problem
The existing radio frequency modules for mobile communication devices face challenges in size reduction due to the need for multiple power amplifiers to support multiband technology, leading to increased module size and potential interference between high-power transmission signals and circuit components, which deteriorates the quality of radio frequency signals.
Innovation Solution
A radio frequency module design with power amplifiers for different frequency bands placed on opposite sides of a module board, along with a switch to manage signal input, allowing for miniaturization while reducing signal leakage and interference, and incorporating heat-dissipating via-conductors to improve thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple power amplifiers are added to support multiband technology, then frequency band coverage is improved, but module size increases
Solution Approach 1:
The patent utilizes the vertical dimension by placing power amplifiers on opposite surfaces of the module board. The first power amplifier is positioned on the first surface while the second power amplifier is positioned on the second surface, effectively using three-dimensional space to accommodate multiple amplifiers without increasing the planar footprint of the module.
Solution Approach 2:
The module board is segmented into two functional surfaces, with different power amplifiers assigned to different surfaces. This segmentation allows independent placement and thermal management of each amplifier, while maintaining compact overall module dimensions.
2Area of stationary object
If multiple power amplifiers are placed close together, then module size is reduced, but signal interference increases
Solution Approach 1:
By separating power amplifiers onto opposite surfaces of the module board, the patent creates sufficient spatial distance between high-power signal sources. This vertical separation significantly reduces electromagnetic coupling and signal interference between amplifiers operating in different frequency bands, while still maintaining a compact planar module size.
3Device complexity
If power amplifiers are placed on the same surface, then wiring is simplified, but thermal management becomes difficult
Solution Approach 1:
The patent distributes heat-generating power amplifiers across opposite surfaces of the module board, effectively utilizing vertical space for thermal management. This separation prevents heat accumulation in a single location, improves heat dissipation efficiency, and allows for independent thermal design of each amplifier without complex thermal coupling.
4Area of stationary object
If module size is reduced, then device portability is improved, but signal quality deteriorates
Solution Approach 1:
The patent achieves a compact module size by utilizing vertical space through opposite surface mounting, while the vertical separation between amplifiers actually improves signal quality by reducing electromagnetic interference. This dimensional approach simultaneously accomplishes miniaturization and signal quality enhancement rather than trading one for the other.
Data Source
AI summary
A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a first power amplifier configured to amplify a transmission signal in a first frequency band; a second power amplifier configured to amplify a transmission signal in a second frequency band different from the first frequency band; and a switch having a first pole connected to an input terminal of the first power amplifier and a second pole connected to an input terminal of the second power amplifier. The first power amplifier and the second power amplifier are disposed on the first principal surface, and the switch is disposed on the second principal surface.