RF Mounting Board Structure for Low-Profile Signal Routing
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Solution Overview
Problem
Existing radio-frequency modules have difficulty in achieving a low-profile structure due to their thickness, which is a challenge in the design of compact communication devices.
Innovation Solution
The radio-frequency module incorporates a mounting board with a layered structure of dielectric and conductive layers, where the conductive layers in one region are fewer than in another, allowing for a thinner first region compared to a second region, enabling a reduced overall thickness while maintaining effective electronic component placement and signal processing capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a conventional layered structure with uniform conductive layers is used, then signal processing capability is maintained, but the module thickness cannot be reduced
Solution Approach 1:
The patent applies local quality by creating regions with different numbers of conductive layers. Specifically, a first region has a first number of conductive layers while a second region has a second number of conductive layers, allowing different areas of the mounting board to have optimized characteristics for their specific functions, thereby reducing overall thickness while maintaining necessary signal processing capabilities.
Solution Approach 2:
The mounting board is segmented into multiple regions with different conductive layer configurations. This segmentation allows the module to have varying thicknesses in different areas, enabling the overall thickness reduction goal to be achieved while still providing adequate signal processing in specific regions where conductive layers are concentrated.
2Length of moving object
If the mounting board is made thinner, then a low-profile structure is achieved, but signal processing capability may be compromised
Solution Approach 1:
By implementing regions with different numbers of conductive layers, the patent ensures that signal processing-critical areas maintain sufficient conductive layer density for reliable operation, while non-critical areas have reduced thickness. This local differentiation allows the mounting board to be thinner overall without compromising signal processing capability in essential regions.
Data Source
AI summary
A radio-frequency module includes a mounting board, a first electronic component, and a second electronic component. The second electronic component is lower in height than the first electronic component. The mounting board includes dielectric layers, conductive layers, and via-conductors. In the mounting board, the dielectric layers and the conductive layers are stacked in the thickness direction of the mounting board. The mounting board has a first region and a second region. The first region overlaps the first electronic component and extends from a first major surface to a second major surface. The second region overlaps the second electronic component and extends from the first major surface to the second major surface. In the mounting board, the conductive layers in the first region are fewer than the conductive layers in the second region. In the mounting board, the first region is thinner than the second region.