RF Module Board Layout for Multi-Band Signal Isolation
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Solution Overview
Problem
In mobile communication devices, simultaneous reception of radio frequency signals from multiple communication bands leads to reduced isolation between reception paths, resulting in decreased reception sensitivity.
Innovation Solution
A radio frequency module configuration with separate semiconductor ICs for amplifying signals from different communication bands, placed on opposite surfaces of a module board, and external-connection terminals to reduce electromagnetic coupling and improve signal isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If multiple reception low noise amplifiers are mounted on the same surface of a wiring board, then device integration is improved, but isolation between reception paths deteriorates
Solution Approach 1:
The patent transitions from two-dimensional planar arrangement to three-dimensional spatial arrangement by mounting reception low noise amplifiers on opposite surfaces of the wiring board. This dimensional change enables simultaneous integration of multiple reception paths while maintaining adequate isolation through the board thickness, resolving the contradiction between integration and isolation.
Solution Approach 2:
The patent segments the reception low noise amplifiers into separate mounting locations on different surfaces of the wiring board. By dividing the mounting space across multiple surfaces rather than concentrating all components on a single surface, the design achieves both high integration and sufficient isolation between reception paths.
2Area of stationary object
If reception low noise amplifiers are placed close together to reduce module size, then compactness is improved, but electromagnetic coupling between signals increases
Solution Approach 1:
By utilizing the third dimension (z-axis) through opposite surfaces of the wiring board, the patent reduces the planar footprint while increasing spatial separation between amplifiers. This dimensional approach simultaneously achieves compactness in the xy-plane and reduced electromagnetic coupling through z-axis separation.
Solution Approach 2:
The wiring board itself acts as an intermediary structure that physically separates reception low noise amplifiers on opposite surfaces. This intermediary provides both mechanical support and electromagnetic isolation, enabling compact module design while minimizing harmful electromagnetic coupling between adjacent reception paths.
Data Source
AI summary
A radio frequency module that simultaneously receives a first reception signal and a second reception signal includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; a first reception low noise amplifier that is disposed in a first semiconductor IC and amplifies the first reception signal; a second reception low noise amplifier that is disposed in a second semiconductor IC different from the first semiconductor IC and amplifies the second reception signal; and an external-connection terminal that is disposed on the second principal surface. At least one of the first semiconductor IC or the second semiconductor IC is disposed on the second principal surface.