RF Power Assembly Bonding Wire Arc Height Optimization

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Solution Overview

Problem

Radio frequency power transistors experience energy loss and risk of burnout due to unbalanced current distribution in bonding wire groups, leading to security risks and inefficiencies in radio frequency signal transmission.

Innovation Solution

A radio frequency power component with a bonding wire group design where arc heights of bonding wires are strategically varied to ensure equal current distribution and minimize phase differences, with higher arc heights at the sides and lower in the central area, optimizing synthesized power and reducing energy loss.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If uniform arc heights are used for all bonding wire units, then manufacturing is simplified, but current distribution becomes unbalanced causing energy loss and burnout risk

Engineering Contradiction:
Improveenergy lossVSAvoidbonding wire structure complexity
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The patent applies local quality by varying the arc heights of bonding wire units based on their positions within the bonding wire group. Specifically, bonding wire units at different locations (edge, corner, center, intermediate positions) are assigned different arc heights to achieve balanced current distribution throughout the group, thereby reducing energy loss while maintaining manufacturing feasibility through a systematic height variation pattern.

Inventive Principle:
Principle #3Local quality

2Reliability

If bonding wires carry different currents, then spatial distribution of radio frequency signal is achieved, but some bonding wires experience excessive current leading to burnout risk

Engineering Contradiction:
Improvebonding wire reliabilityVSAvoidradio frequency signal transmission efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent changes the geometric parameter of arc height for bonding wire units to control and balance the current distribution. By adjusting the arc heights of different bonding wire units to specific values (higher for edge/corner units, lower for center units), the patent ensures that all bonding wires operate within safe current limits while maintaining efficient radio frequency signal transmission, thus improving reliability without sacrificing productivity.

Inventive Principle:
Principle #35Parameter changes

3Loss of energy

If arc heights of bonding wire units are adjusted to balance current, then energy loss is reduced, but manufacturing precision requirements increase

Engineering Contradiction:
Improveenergy lossVSAvoidarc height precision
Core Design Contradiction:
Loss of energyVSManufacturing precision

Solution Approach 1:

The patent segments the bonding wire group into distinct positional categories (edge units, corner units, center units, intermediate units) and assigns specific arc height values to each segment. This segmentation approach simplifies the manufacturing process by providing clear, discrete height specifications for different groups of bonding wires, making it easier to achieve the required precision through standardized manufacturing procedures rather than requiring individual customization of each bonding wire.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentEP3188221B1Radio frequency power assembly and transceiver device
Publication Date: 2021.08.18 HUAWEI TECH CO LTD
  • EP3188221B1 patent drawingFigure 1~2
  • EP3188221B1 patent drawingFigure 3~4
  • EP3188221B1 patent drawingFigure 5

AI summary

The present invention provides a radio frequency power component, including a first section, a second section, and a first bonding wire group, where the first bonding wire group includes at least three first bonding wire units, the first bonding wire unit includes at least one arc-shaped bonding wire, one end and the other end of the first bonding wire unit are electrically connected to electrodes of the first section and the second section, respectively, where arc heights of first bonding wire units located at two sides of the first bonding wire group are higher than an arc height of a first bonding wire unit at another position, and an arc height of a first bonding wire unit located in a central area of the first bonding wire group is lower than an arc height of a first bonding wire unit at another position, so that currents passing through the at least three first bonding wire units are the same, or a phase difference between currents passing through any two first bonding wire units is less than a preset threshold. The present invention significantly reduces an energy loss of the radio frequency power component, avoids damage to a section, and reduces a usage cost.