RF Bridge for Multi-Chip Module Interconnects
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Solution Overview
Problem
Legacy RF multi-chip modules face challenges in meeting stringent future specifications for interconnectivity, shielding, and thermal management, particularly with wire-bonds leading to increased package area, inadequate shielding, and undesirable heat extraction paths.
Innovation Solution
The use of a passive or active die as a bridge within RF multi-chip modules provides improved interconnectivity, electromagnetic shielding, and thermal extraction, allowing for higher interconnect density and reduced package area, while enabling efficient heat management through the use of bridges that connect RF components and the package substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If wire-bonds are used for RF interconnectivity, then connectivity between chips is achieved, but package area increases and interconnect density decreases
Solution Approach 1:
The patent transitions from planar wire-bond interconnects to three-dimensional vertical vias and conductive pathways through the substrate. By routing signals through the depth of the substrate rather than across its surface, the design achieves higher interconnect density without increasing package footprint, effectively moving the interconnection strategy into the third dimension.
Solution Approach 2:
The patent introduces an intermediary substrate with integrated conductive pathways that mediates between the RF chips and external connections. This substrate acts as an intermediate layer that provides high-density interconnect routing, eliminating the need for extensive wire-bonds while maintaining signal integrity and reducing the overall package area.
2Object-affected harmful factors
If wire-bonds are used for RF shielding, then electromagnetic shielding is provided, but shielding effectiveness becomes inadequate at higher frequencies
Solution Approach 1:
The patent replaces the mechanical wire-bond shielding structure with an integrated electromagnetic shielding system embedded in the substrate. This includes continuous conductive planes, ground shields, and RF ground connections that provide superior electromagnetic shielding effectiveness, particularly at higher frequencies where wire-bond shielding becomes inadequate.
Solution Approach 2:
The patent employs composite shielding structures combining multiple conductive materials and configurations within the substrate, including copper or aluminum ground planes, via arrays, and shielded transmission lines. This composite approach creates a multi-layered shielding system that effectively attenuates RF signals across a broad frequency range.
3Temperature
If wire-bonds are used for heat extraction, then thermal management is provided, but heat extraction paths are undesirable and thermal performance is limited
Solution Approach 1:
The patent introduces the substrate as an intermediary thermal management system that provides dedicated thermal pathways between the RF chips and heat sinks. The substrate incorporates thermal vias, heat spreaders, and thermally conductive pathways that efficiently conduct heat away from the chips, replacing the inadequate thermal extraction capability of wire-bonds.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it provides electrical interconnection, electromagnetic shielding, and thermal management. By integrating these functions into a single substrate structure, the patent achieves efficient heat extraction through the same intermediary component that handles signal routing and shielding, eliminating the need for separate wire-bond thermal paths.
Data Source
AI summary
Embodiments may relate to a radio frequency (RF) multi-chip module that includes a first RF die and a second RF die. The first and second RF dies may be coupled with a package substrate at an inactive side of the respective dies. A bridge may be coupled with an active side of the first and second RF dies die such that the first and second RF dies are communicatively coupled through the bridge, and such that the first and second RF dies are at least partially between the package substrate and the bridge. Other embodiments may be described or claimed.