RF Can Aperture Shielding for Semiconductor Package EMI Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor packages and printed circuit boards are vulnerable to electromagnetic interference (EMI) due to inadequate shielding, which can cause malfunctions or reduced efficiency, and existing shielding methods like RF cans with apertures and conformal coatings are inefficient or require multiple steps.
Innovation Solution
A deposition layer is applied selectively to provide electromagnetic shielding, comprising portions that are deposited across apertures and terminals, narrowing the aperture and electrically coupling the RF can to the substrate, without the need for masks or additional layers, using materials like copper, silver, or dielectric ink, and can be cured to form a shield for both optical devices and semiconductor packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an RF can with aperture is used for electromagnetic shielding, then shielding effectiveness is improved, but manufacturing complexity increases due to multiple steps and masks
Solution Approach 1:
The patent combines multiple shielding functions into a single deposition layer that simultaneously provides aperture coverage, electrical coupling, and EMI shielding. This eliminates the need for separate masks and multiple deposition steps, reducing manufacturing complexity while maintaining shielding effectiveness.
Solution Approach 2:
The deposition layer serves multiple functions: it narrows the aperture for optical alignment, provides electrical coupling between the RF can and substrate, and creates electromagnetic shielding. This multi-functional approach replaces traditional multi-step processes with a single integrated solution.
2Object-affected harmful factors
If conventional shielding methods are used, then EMI protection is provided, but manufacturing time and steps increase
Solution Approach 1:
The deposition layer is applied in advance to simultaneously perform aperture narrowing, electrical coupling, and shielding functions before final assembly. This preliminary multi-functional deposition eliminates subsequent separate steps, improving manufacturing efficiency while maintaining EMI protection.
3Reliability
If multiple deposition layers are used for shielding, then shielding coverage is improved, but manufacturing complexity and time increase
Solution Approach 1:
The patent merges multiple shielding layers into a single multi-functional deposition layer that achieves comprehensive shielding coverage while eliminating the time required for multiple separate deposition processes. The single layer simultaneously provides aperture coverage and electrical coupling functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces EMI interference by providing efficient and selective shielding for semiconductor packages and printed circuit boards, improving their operational efficiency and manufacturing efficiency by eliminating the need for multiple steps in the shielding process.
Implementation Method 1
depositing a deposition layer, wherein the deposition layer includes at least a first portion of the deposition layer and a second portion of the deposition layer, wherein the first portion of the deposition layer is deposited across the first aperture of the RF can
Implementation Method 2
curing the deposition layer; and wherein the cured deposition layer electrically couples to the RF can and to the first terminal of the substrate
Data Source
AI summary
Methods, systems, and apparatuses for electromagnetic shielding are provided, particularly for semiconductor packages and/or printed circuit boards. For example, an optical device covered by an RF can may be attached to a substrate. The RF can may have a first aperture for an optical path of the optical device. A deposition layer may provide electromagnetic shielding in conjunction with the RF can. The deposition layer may include one or more portions that are deposited at the same time, including a first portion with an aperture that narrows the aperture of the RF can. The deposition layer, after being deposited, may be cured. The deposition layer and RF can may provide electromagnetic shielding for the optical device.