RF Chip Package with Segmented FEIC and Core Member
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Solution Overview
Problem
Current radio frequency (RF) chip packages face challenges in efficiently managing power consumption, heat generation, and size reduction while maintaining performance, especially when integrating front-end amplification circuits, which complicates the transmission and reception of high-frequency RF signals in millimeter wave communications.
Innovation Solution
The RF chip package separates the front-end integrated circuit (FEIC) for amplification from the radio frequency integrated circuit (RFIC), using a core member with insulating and wiring layers to create cavities and reduce size, and employs multiple FEICs for multi-frequency band communication, with improved electromagnetic isolation and energy efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the front-end integrated circuit (FEIC) for amplification is integrated with the radio frequency integrated circuit (RFIC), then device functionality is enhanced, but device complexity and heat generation increase
Solution Approach 1:
The patent divides the RF system into separate functional modules: the RFIC handles signal processing while the FEIC handles amplification. These are physically separated but electrically connected through controlled impedance traces on the substrate, allowing independent optimization of each module while maintaining overall system functionality.
Solution Approach 2:
The substrate acts as an intermediary between the RFIC and FEIC, providing controlled impedance transmission paths for RF signals. The substrate design includes specific trace geometries and grounding structures that mediate the electrical connection while maintaining signal integrity and electromagnetic isolation.
2Adaptability or versatility
If the front-end integrated circuit (FEIC) for amplification is integrated with the radio frequency integrated circuit (RFIC), then device functionality is enhanced, but heat generation increases
Solution Approach 1:
By segmenting the amplification function into a separate FEIC module, the heat source is physically separated from the RFIC. This allows for independent thermal management strategies, such as placing the FEIC on a separate substrate or providing dedicated heat sinking paths, thereby reducing the thermal load on the RFIC.
3Volume of moving object
If the package size is reduced, then integration density increases, but electromagnetic isolation between circuits becomes difficult to maintain
Solution Approach 1:
The patent transitions from planar circuit layout to three-dimensional substrate stacking. The RFIC and FEIC are positioned on different layers of the substrate with vertical via connections, allowing electromagnetic isolation in the vertical dimension while maintaining compact horizontal footprint. Ground planes and shielding structures are implemented between layers to prevent electromagnetic coupling.
4Adaptability or versatility
If multiple FEICs are used for multi-frequency band communication, then communication versatility improves, but device complexity increases
Solution Approach 1:
The substrate design incorporates universal RF transmission structures that can support multiple frequency bands. The same basic trace geometry and grounding scheme can handle different RF frequencies, allowing multiple FEICs to be integrated without proportionally increasing circuit design complexity. The substrate acts as a multi-functional platform that accommodates various RF configurations.
Data Source
AI summary
A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.