3D RF Circuit Routing for Isolation and Low Path Loss
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Solution Overview
Problem
Current radio frequency circuits face challenges in achieving improved isolation characteristics and reduced path loss, especially in multiband and multimode communication devices, where multiple radio-frequency signals need to be processed without degradation.
Innovation Solution
The radio frequency circuit design incorporates a substrate with components mounted on both surfaces, utilizing wiring lines that traverse through the substrate to reduce parasitic capacitance and path length, allowing for non-overlapping paths and efficient signal transmission between the surfaces, thereby enhancing isolation characteristics and suppressing path loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If wiring lines are routed on the rear surface and front surface of the substrate, then the number of wiring lines extending in the planar direction is increased, but this increases parasitic capacitance and path length
Solution Approach 1:
The patent transitions wiring line routing from a two-dimensional planar configuration to a three-dimensional configuration by routing lines through the substrate thickness direction. This allows signal paths to traverse vertically between front and rear surfaces rather than extending horizontally, reducing parasitic capacitance and enabling shorter effective path lengths while maintaining connection functionality.
Solution Approach 2:
Instead of extending wiring lines in the conventional planar direction across the substrate surface, the patent inverts the routing approach by extending lines in the thickness direction through the substrate. This inversion of the routing dimension fundamentally reduces the planar footprint and parasitic effects associated with traditional surface mounting.
2Reliability
If wiring lines are routed on the rear surface and front surface of the substrate, then connectivity is achieved, but the path length increases
Solution Approach 1:
The patent utilizes the third dimension (substrate thickness) to create direct vertical pathways for signal transmission. This eliminates the need for lengthy detours across the substrate surface, reducing wiring line length while maintaining reliable electrical connectivity between components on opposite surfaces.
3Adaptability or versatility
If multiple radio-frequency paths are implemented, then multiband and multimode functionality is achieved, but wiring lines of different paths may overlap
Solution Approach 1:
The patent employs three-dimensional wiring routing through the substrate to spatially separate multiple radio-frequency paths in the vertical dimension. This allows different signal paths to traverse the substrate thickness at different locations, preventing planar overlap and improving isolation characteristics while supporting multiband and multimode functionality.
Solution Approach 2:
The patent segments the wiring line paths in the thickness direction, creating distinct vertical channels for different radio-frequency signals. This segmentation prevents interference between multiple paths by providing physically separated transmission channels, thereby improving isolation while maintaining multiband and multimode capabilities.
Data Source
AI summary
A radio frequency circuit includes a substrate, a first terminal disposed on a first principal surface of the substrate, a second terminal disposed on the first principal surface, a first-surface mounted component disposed on the first principal surface or inside the substrate, and a second-surface mounted component disposed on a second principal surface of the substrate which is opposite the first principal surface. A radio-frequency signal, which is input to the first terminal, is transmitted, for output from the second terminal, so as to make at least one round trip between the first principal surface and the second-surface mounted component, which is disposed on the second principal surface, through wiring lines disposed in the substrate.