RF Circuit Feedback Path Sharing for Compact Wireless Devices
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Solution Overview
Problem
The complexity and space constraints in portable electronic devices make it challenging to implement circuit configurations for processing ultra-high frequency signals and feedback signals effectively, particularly in small-sized and lightweight devices.
Innovation Solution
The solution involves interconnecting RF circuits to deliver feedback signals through a reception path of another RF circuit, creating a feedback path for transmission signals in electronic devices, which simplifies the circuit configuration and reduces component requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate circuit configurations are used for processing ultra-high frequency signals and feedback signals, then signal processing capability is improved, but device complexity and mounting space requirements increase
Solution Approach 1:
The patent combines the ultra-high frequency signal processing circuit and feedback signal processing circuit into a shared circuit configuration. The same circuit components process both transmission signals and feedback signals, eliminating the need for separate dedicated circuits for each function.
Solution Approach 2:
The circuit configuration is designed to perform multiple functions: it processes ultra-high frequency transmission signals and also handles feedback signals. This multi-functional approach allows a single circuit to replace what would traditionally require separate dedicated circuits, reducing overall system complexity.
2Reliability
If separate circuit configurations are used for processing ultra-high frequency signals and feedback signals, then signal processing capability is improved, but mounting space requirements increase
Solution Approach 1:
The patent merges the feedback signal processing path with the existing ultra-high frequency signal processing circuit. By combining these functions into a shared circuit, the physical space required for mounting is significantly reduced compared to having separate dedicated circuits for each function.
Solution Approach 2:
The circuit is designed to handle multiple signal types (transmission and feedback) through the same physical components, thereby reducing the total mounting area required. This multi-functional circuit occupies less space than separate dedicated circuits would require.
3Reliability
If complex circuit configurations are implemented, then signal processing capability is improved, but ease of manufacture decreases
Solution Approach 1:
The patent combines multiple signal processing functions into a single integrated circuit configuration, which simplifies the manufacturing process. Instead of assembling and calibrating separate circuits for transmission and feedback processing, a unified circuit reduces assembly steps and potential points of failure.
Solution Approach 2:
The multi-functional circuit design reduces the total number of components that need to be manufactured and assembled. By having one circuit perform multiple functions, the manufacturing process becomes simpler and more cost-effective compared to producing and integrating multiple separate circuits.
Data Source
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AI summary
An electronic device is provided, which includes a housing, a first antenna at a first position, a second antenna at a second position, and a wireless communication circuit inside the housing and connected to the first and second antennas and including modem, a source RF circuit connected to modem and generating an IF signal, a first RF circuit at a third position closer to the first position, a second RF circuit at a fourth position closer to the second position, wherein the first and second RF circuits alternately receive a signal from the source RF circuit to transmit a signal through the first and second antennas, a first electrical path between the source RF circuit and the first RF circuit, a second electrical path between the source RF circuit and the second RF circuit, and a third electrical path between the first and second RF circuits, wherein the first RF circuit transmits a first feedback of the transmission signal to the source RF circuit through the third and second electrical paths, and wherein the second RF circuit transmits a second feedback of the transmission signal to the source RF circuit through the third and first electrical paths.