Circuit Shielding Structure for RF Interference and Thermal Management
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Solution Overview
Problem
Smartphones and other electronic products with radio frequency components often suffer from electromagnetic interference, affecting circuit functionality due to lack of effective shielding solutions.
Innovation Solution
A circuit shielding structure comprising a substrate with a radio frequency component circuit, a wave-absorbing material layer, a conductive material layer, and a shielding wall, along with a ground layer for zero-potential shielding, which forms a closed space for omnidirectional shielding and includes a heat dispersion layer for thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shielding structure is added to protect radio frequency components from electromagnetic interference, then electromagnetic shielding performance is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple shielding functions into a single integrated structure. The shielding wall is formed by integrating the conductive material layer with the wave-absorbing material layer, creating a unified shielding component that provides both reflection and absorption shielding mechanisms simultaneously, rather than using separate layers for each function.
Solution Approach 2:
The shielding wall structure serves multiple functions: it provides electromagnetic shielding through the conductive material layer, absorbs electromagnetic waves through the wave-absorbing material layer, and contributes to heat dissipation. This multi-functional design reduces the need for additional separate components.
2Object-affected harmful factors
If a closed space shielding structure is formed around radio frequency components, then shielding effectiveness is improved, but manufacturing complexity increases
Solution Approach 1:
The conductive material layer is designed as a thin film or coating that can be applied to the shielding wall structure. This thin-film approach simplifies manufacturing compared to creating thick rigid shielding components, while still providing effective electromagnetic shielding when formed into a closed space configuration.
3Object-affected harmful factors
If wave-absorbing material is used to shield electromagnetic interference, then shielding performance is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent employs composite material structures where the conductive material layer and wave-absorbing material layer are integrated. The conductive material layer provides both electromagnetic shielding and heat dissipation pathways, while the wave-absorbing material layer absorbs electromagnetic energy. Together, they form a composite shielding system that addresses both shielding and thermal management requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively shields against electromagnetic interference while also providing excellent heat dispersion, enhancing the reliability and longevity of radio frequency component circuits in electronic devices.
Implementation Method 1
a wave-absorbing material layer is embedded in the substrate
Implementation Method 2
a conductive material layer covers the shielding wall; a closed space is formed among the substrate in which the wave-absorbing material layer is embedded, the shielding wall and the conductive material layer; the radio frequency component circuit is sealed in the closed space, so that omnidirectional shielding is achieved
Implementation Method 3
Through grounding by the ground terminal on the substrate, zero-potential shielding of the conductive material layer is realized
Implementation Method 4
which forms a closed space for omnidirectional shielding and includes a heat dispersion layer for thermal management
Data Source
AI summary
A circuit shielding structure, relating to a technical field of electronics, includes a substrate, wherein: at least one radio frequency component circuit is fixed on the substrate; a wave-absorbing material layer is embedded in the substrate; a shielding wall made of wave-absorbing material is arranged on the substrate and around the radio frequency component circuit; a conductive material layer covers the shielding wall; a closed space is formed among the substrate in which the wave-absorbing material layer is embedded, the shielding wall and the conductive material layer, and the radio frequency component circuit is sealed in the closed space, so that omnidirectional shielding is achieved.