RF Circuit Substrate Trenches for Signal Isolation
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Solution Overview
Problem
Conventional printed circuit board (PCB) manufacturing processes are costly, time-consuming, and limited in their ability to produce small feature sizes, which restricts their capability to support high-frequency radio frequency (RF) signals beyond a certain range.
Innovation Solution
The use of subtractive and additive manufacturing techniques to create vertical trenches filled with conductive material, forming a continuous electromagnetic boundary within RF circuits, enabling enhanced signal isolation and supporting frequencies up to 300 GHz or more.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional PCB manufacturing processes are used, then manufacturing simplicity is maintained, but manufacturing precision and ability to produce small feature sizes deteriorate
Solution Approach 1:
The invention divides the manufacturing process into two distinct stages: subtractive manufacturing to create precise trenches and holes, then additive manufacturing to fill them with conductive material. This segmentation allows each process to be optimized independently, achieving small feature sizes without requiring the entire process to be highly complex
Solution Approach 2:
The patent uses dielectric material as an intermediary substance that is first deposited to form the substrate, then trenches are cut through it, and finally conductive material is added to create the circuit features. This intermediary dielectric layer enables precise positioning and isolation of conductive elements
2Productivity
If conventional PCB manufacturing processes are used, then manufacturing cost is maintained, but productivity and turnaround time deteriorate
Solution Approach 1:
The invention performs preliminary actions by first creating the trench structures through subtractive manufacturing before adding conductive material. This preliminary preparation of precise geometric features enables faster subsequent filling operations and reduces the need for multiple iterative manufacturing cycles
Solution Approach 2:
The patent changes the manufacturing parameters by transitioning from purely subtractive conventional PCB processes to a hybrid approach combining subtractive trench creation with additive material deposition. This parameter change enables faster production cycles while maintaining cost-effectiveness through reduced material waste and fewer process iterations
3Manufacturing precision
If conventional PCB manufacturing processes are used, then ease of manufacture is maintained, but manufacturing precision for high frequency signals deteriorates
Solution Approach 1:
The invention moves from two-dimensional planar PCB manufacturing to three-dimensional structured circuits by creating vertical trenches and holes through the dielectric substrate. This dimensional transition enables precise control of signal trace dimensions in multiple directions, achieving the precision required for high-frequency signals while maintaining manufacturing simplicity through automated processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the fabrication of RF circuits with smaller feature sizes, allowing for higher frequency operation in the microwave and millimeter wave ranges while reducing manufacturing complexity and cost, and enabling the production of low-profile, lightweight circuits suitable for advanced applications.
Implementation Method 1
providing a continuous electromagnetic boundary (e.g., electrical conductor) within a circuit
Implementation Method 2
The electrically continuous conductive material may be configured to at least partially contain an electromagnetic field within a confined region of the radio frequency circuit
Data Source
AI summary
A radio frequency circuit includes at least one dielectric substrate, a trench formed in the dielectric substrate, and an electrically continuous conductive material in the trench. The radio frequency circuit further may include a first dielectric substrate, a second dielectric substrate, with the trench being formed in the first and second dielectric substrates. A method of fabricating an electromagnetic circuit includes providing at least one dielectric substrate, machining a trench in the at least one dielectric substrate, and filling the trench with an electrically conductive material to form an electrically continuous conductor.