Moisture-Resistant RF Component with Metal Shielding
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Solution Overview
Problem
Current moisture-resistant radiofrequency packaging technologies are either heavy and bulky due to inorganic materials or lack electrical shielding with organic materials, failing to meet requirements for compactness, reliability, heat dissipation, and 3D integration while protecting sensitive III-V semiconductors from corrosion.
Innovation Solution
An electronic component with integrated shielding is developed, comprising a metal plate connected to the electronic circuit, surrounded by organic layers using a printed circuit technique, and a thermally conductive metal surface, forming a Faraday cage to prevent moisture ingress and ensure reliable mounting and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If inorganic materials (metal or ceramic) are used for moisture-resistant packaging, then reliability and moisture protection are improved, but weight and volume increase significantly
Solution Approach 1:
The patent uses a composite structure combining organic material (LCP substrate) with inorganic shielding elements (metal plate and via holes). This allows the package to achieve moisture protection and electrical shielding without using entirely inorganic materials, thereby reducing weight while maintaining reliability
Solution Approach 2:
Instead of using heavy inorganic materials throughout the entire package, the patent applies shielding elements locally - a metal plate at the bottom for ground connection and heat dissipation, and via holes at specific locations for electrical shielding. This localized approach provides necessary protection while minimizing weight
2Reliability
If inorganic materials (metal or ceramic) are used for moisture-resistant packaging, then reliability and moisture protection are improved, but the package becomes bulky
Solution Approach 1:
The LCP (liquid crystal polymer) organic substrate provides a compact, lightweight base structure with inherent moisture resistance. When combined with thin metal shielding layers and via holes, it achieves the required reliability without the bulk of traditional all-inorganic packages
Solution Approach 2:
The patent utilizes vertical via holes to provide electrical shielding and ground connection in the Z-dimension (vertical direction) rather than requiring lateral extension. This allows compact planar dimensions while maintaining shielding effectiveness through the thickness of the package
3Weight of stationary object
If organic resin encapsulation is used for packaging, then weight and volume are reduced, but electrical shielding capability is lost
Solution Approach 1:
The patent creates a composite structure where the LCP organic substrate provides the lightweight base, while embedded metal elements (via holes and bottom metal plate) provide electrical shielding. This combination maintains the weight advantages of organic materials while adding the shielding capability previously only available with inorganic materials
Solution Approach 2:
The via holes filled with conductive material act as intermediary shielding elements within the organic LCP substrate. These via holes provide the necessary electrical shielding and ground connection without requiring the entire package structure to be inorganic, thus maintaining the benefits of organic materials
4Reliability
If metal plate is added for shielding and heat dissipation, then reliability and thermal management are improved, but device complexity increases
Solution Approach 1:
The metal plate at the bottom of the package serves multiple functions simultaneously: it provides electrical ground connection for shielding, acts as a heat sink for thermal management, and serves as a mounting surface for the electronic component. This multi-functionality reduces the need for separate elements, thereby limiting the increase in complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a compact, reliable, and moisture-resistant electronic component with integrated shielding, addressing the limitations of existing technologies by ensuring effective heat dissipation and minimizing crosstalk, while maintaining the integrity of sensitive radiofrequency components.
Implementation Method 1
a coupling agent between the front face of the metal plate and the back face of the electronic circuit, configured to thermally and electrically connect the metal plate to the electronic circuit
Implementation Method 2
an array of metal elements arranged at a distance from the electronic circuit so as to form a Faraday cage containing the electronic circuit
Implementation Method 3
a thermally conductive metal surface arranged at least partially in contact with the back face of the metal plate
Data Source
AI summary
An electronic component includes a first set comprising an interconnect layer and an electronic circuit having a front face and a back face, which is connected to the interconnect layer by the front face, wherein the first set comprises a metal plate having a front face and a back face joined to the back face of the electronic circuit; a coupling agent between the front face of the metal plate and the back face of the electronic circuit, configured to thermally and electrically connect the metal plate to the electronic circuit; and in that the electronic component comprises: one or more layers made of organic materials stacked around the first set and the metal plate using a printed circuit-type technique and encapsulating the electronic circuit; a thermally conductive metal surface arranged at least partially in contact with the back face of the metal plate.